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Conferences > OFC > 2023 > M3I > M3I.4

A Direct Bond Interconnect 3D Co-Integrated Silicon-Photonic Transceiver in 12nm FinFET with -20.3dBm OMA Sensitivity and 691fJ/bit

Anirban Samanta, Po-Hsuan Chang, Peng Yan, Mingye Fu, Mehmet Berkay-On, Ankur Kumar, Hyungryul Kang, Il-Min Yi, Dedeepya Annabattuni, Yu Zhang, David Scott, Robert Patti, Yang-Hang Fan, Yuanming Zhu, Samuel Palermo, and S.J. Ben Yoo

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Abstract

We present the first experimental demonstration of an electronic-photonic co-designed transceiver circuit heterogeneously 3D co-integrated with high-density, low-parasitic Direct Bond Interconnect (DBI®) featuring full SerDes that achieves -20.3dBm OMA sensitivity and 691fJ/bit link energy efficiency.

© 2023 The Author(s)

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