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Conferences > OFC > 2021 > Th4A > Th4A.4

3D-Integrated Multichip Module Transceiver for Terabit-Scale DWDM Interconnects

Stuart Daudlin, Anthony Rizzo, Nathan C. Abrams, Sunwoo Lee, Devesh Khilwani, Vaishnavi Murthy, James Robinson, Terence Collier, Alyosha Molnar, and Keren Bergman

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Abstract

We present the architecture and assembly of a compact, 3D-integrated CMOS-silicon photonic transceiver for DWDM interconnects. The transceiver interleaves 64 parallel wavelength channels enabling energy efficient scaling of multi-Tbps/mm2 bandwidth densities for future co-packaged chipsets.

© 2021 The Author(s)

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