Abstract

High speed photoreceivers operating at over 10 GHz, in recent optical communication systems such as coherent transmission systems, must have high performance, broadband, easy-to-assemble, and reliable characteristics. In conventional photoreceivers, however, the frequency characteristic is limited by the wire interconnection technique between photodiode and preamplifier chips because of parasitic elements such as stray capacitance and inductance. Recently, the gold bump flip-chip interconnection technique¹ was developed to overcome this problem. However, the gold bump interconnection technique needs careful alignment between chips because of small bump size; it also has the possibility of increasing dark current during the bonding process. This paper presents a novel flip-chip interconnection technique for high performance photoreceivers using solder bumps, as shown in Fig. 1.

© 1990 Optical Society of America