Abstract

In recent years, the demand for low-cost high-performance optical interconnect components has increased. One solution has been found with the development of the vertical cavity surface emitting laser (VCSEL) [1]. The VCSEL has a number of attractive characteristics for interconnects such as low operating voltage and current, low divergence circular beam, and the possibility of on-wafer testing and flip-chip mounting. While simple beam shaping can be accomplished using refractive optics, monolithically or in hybrid, more complex beam shaping such as combined beam splitting and focusing for optical fan-out can only be accomplished using diffractive optical elements (DOEs) [2]. Ideally, the DOE should be monolithically integrated with the VCSEL.

© 1998 IEEE