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  • Journal of Lightwave Technology
  • Vol. 41,
  • Issue 16,
  • pp. 5350-5358
  • (2023)

4×100Gb/s PAM4 Multi-Channel Silicon Photonic Chipset With Hybrid Integration of III-V DFB Lasers and Electro-Absorption Modulators

Jacob S. Levy, Erman Timurdogan, Yu-Sheng Kuo, Gap Youl Lyu, Charles Tsai, Xuejin Yan, Harqkyun Kim, Cristian Stagarescu, Kevin Meneou, Abu Thomas, Ioannis Fragkos, Geoffrey Sitwell, Andrea Trita, Yangyang Liu, Melissa Ziebel, Jerry Byrd, Sven Steinbach, Bruce Chou, William Vis, Arin Abed, Young Kwon, Henri Nykänen, Shih-Han Lo, Janne Ikonen, Juha Larismaa, John Drake, Albert Benzoni, Cyriel Minkenberg, Thomas Schrans, and Andrew Rickman

Open Access Open Access

Abstract

A silicon photonic based transmitter and receiver chipset for 4×106Gb/s 400 GBASE-DR4 data rates is presented. Each channel of the transmitter chip reaches high extinction ratio and optical modulation amplitude (OMA) with a low TDECQ penalty in full compliance with the IEEE standard. The receiver chips possess high responsivity with low polarization dependent loss. The use of discrete III-V arrayed components hybridized onto the silicon platform and passive alignment of single-mode fibers provides a low-cost, compact and scalable solution extendable to even higher aggregate rates and channel count.

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