Abstract
This paper presents the latest progress toward fully embedded board-level optical
interconnects in the aspect of waveguide fabrication and device integration. A one-step
pattern transfer method is used to form a large cross-section multimode waveguide array
with 45° micromirrors by silicon hard molding method. Optimized by a novel
spin-coating surface smoothing method for the master mold, the waveguide propagation
loss is reduced to 0.09 dB/cm. The coupling efficiency of the metal-coated reflecting
mirror, which is embedded in the thin-film waveguide, is simulated by an M<sup>2</sup> factor
revised Gaussian beam method and is experimentally measured to be 85%. The active
optoelectronic devices, vertical surface emitter lasers and p-i-n photodiodes, are
integrated with the mirror-ended waveguide array and successfully demonstrate a 10 Gbps
signal transmission over the embeddable optical layer.
© 2008 IEEE
PDF Article
More Like This
Cited By
You do not have subscription access to this journal. Cited by links are available to subscribers only. You may subscribe either as an Optica member, or as an authorized user of your institution.
Contact your librarian or system administrator
or
Login to access Optica Member Subscription