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Conferences > OFC > 2016 > Th3F > Th3F.1

A Compact 2.5D Stacked Transmitter for Parallel Optical Interconnects

C. Li, T. Li, E. Smalbrugge, R. Stabile, and O. Raz

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Abstract

2.5D silicon interposer, for a cost effective optoelectronic package, is proposed and fabricated on a wafer level. Using this packaging approach, the fully assembled 120 Gb/s transmitter is scaled down to 6mm × 7mm.

© 2016 Optical Society of America

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