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Conferences > ECEOC > 2012 > Tu.3.E > Tu.3.E.2

A Novel 3D Stacking Method for Opto-Electronic Dies on CMOS ICs

P. Duan, O. Raz, B. E. Smalbrugge, J. Duis, and H. J. S Dorren

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Abstract

High speed, high density and low cost solution for realizing optical interconnects is presented. An opto-electronic die, directly bonded on top of CMOS IC driver, is connected using metal traces lithographically defined. A twelve channel transmitter based on the technique was fabricated, and test shows good performance up to 12.5 Gb/s/ch.

© 2012 Optical Society of America

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