Abstract

Analysis of today's logic interface fiber-optic modules reveals that both manufacturability and cost are not constrained by the semiconductors that implement the functionality, but rather by the packaging and interconnects. We have developed an innovative assembly technology that eliminates traditional hermetic metal enclosures, separate optical subassemblies, and circuit boards. This approach benefits from commonality with the plastic packaging of integrated circuits, and has already been successfully applied to modules operating with large core fiber in benign environments. We believe this is the first example successfully extending this technology to long-wavelength telecommunication applications in uncontrolled operating environments. We have designed a SONET1 intermediate reach 155 Mbit/s logic interface optical receiver module based on this novel packaging.

© 1996 Optical Society of America

PDF Article
More Like This
Small Low-Cost MU-Receptacle 10-Gbit/s Plastic Optical Receiver Module with a Three-Dimensional Circuit Structure

T. Kurosaki, Y. Shuto, Y. Tamura, A. Ohki, S. Kimura, and Y. Suzuki
FG4 Optical Fiber Communication Conference (OFC) 2003

Alignment-free injection-molded plastic modules for free-space optical interconnection

Tae Jin Kim, David T. Neilson, and Eugen Schenfeld
CThG3 Conference on Lasers and Electro-Optics (CLEO) 1998

Plastic optical module having a pre-insert molded SC ferule and a laser diode with mode-field converter

H. Mori, S. Tamura, S. Suga, and M. Iwase
ThS2 Optical Fiber Communication Conference (OFC) 1998

References

You do not have subscription access to this journal. Citation lists with outbound citation links are available to subscribers only. You may subscribe either as an Optica member, or as an authorized user of your institution.

Contact your librarian or system administrator
or
Login to access Optica Member Subscription