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Conferences > OECC > 1996 > 18D3 > 18D3.4
  • First Optoelectronics and Communications Conference
  • Technical Digest Series (Optica Publishing Group, 1996),
  • paper 18D3.4

High Stability Low-Cost Optical Module Packaging for the Access Market

S. Turley, R. Baker, J. Leach, T. Bricheno, I. Woods, D. Spear, N. Lambert, J. Severn, R. Simpson, and R. Buckley

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Abstract

Optical transmitter module assemblies based on Si V groove alignment technology show repeatably high coupled power (66% greater than lmW ex-fibre) and excellent stability under extreme environmental testing (-55°C to 100°C temperature cycling)

© 1996 IEICE

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