Abstract

We report the hybrid integration of a monolithic array of surface-emitting microlasers onto a glass substrate that contains a matching array of microlenses and mirrors. The microlaser array is bonded onto the glass substrate by flip-chip solder bump bonding. An array of indium solder bumps simultaneously provides the electrical contacts to the lasers and the mechanical mounts between the chip and the substrate. The alignment precision is within a few micrometers. By using a reflow process, this precision can be improved to less than one micrometer. The optical substrate provides a simple interconnection scheme that routes the light from each laser to well defined output positions. The optics consists of diffractive, "binary optics" type lenses and mirrors that are all integrated on a single quartz glass substrate. The hybrid integration of the passive optics with optoelectronic devices using flip-chip bonding is an approach to make optical interconnections applicable to electronic VLSI systems.

© 1992 Optical Society of America