Abstract
A 16x16 Vertical Cavity Surface Emitting Laser Array Module for Optical Processing and Interconnect Applications, D. Paananen, J. Wasserbauer, J. Scott, P. Brusenbach and D. Lewis, Vixel Corporation, G. Simonis, Army Research Laboratory. We integrated 16x16 VCSEL arrays onto silicon driver circuits using In/Pb solder bump bonding. Each VCSEL is randomly accessed via the silicon circuit.
© 1997 Optical Society of America
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