Abstract

A critical problem for the realization of practical integrated-optical circuits in semiconductor materials is that the optimum optical waveguide mode sizes are different for different types of circuit elements. Previously reported techniques for tapering the composition and/or depth of waveguides have been limited in their capabilities, ease of implementation, or ranges of applications.^1-3 We report here a new technique, using a dynamic etch mask, that makes it possible to fabricate semiconductor waveguide and device structures with a smooth, gradual, tapered etch depth in various orientations at arbitrary locations on a sample.

© 1990 Optical Society of America