Abstract
We present and discuss different approaches and technologies for optical interconnects to Silicon chips with a focus on low-cost, chip-compatible, three-dimensional free-space plastic micro-optical interconnect modules.
© 2004 Optical Society of America
PDF ArticleMore Like This
E. Towe
FTuP3 Frontiers in Optics (FiO) 2005
David A. B. Miller
FThM1 Frontiers in Optics (FiO) 2004
Rohit Nair, Tian Gu, Michael E. Teitelbaum, Keith W. Goossen, Fouad Kiamilev, and Michael W. Haney
CFJ3 CLEO: Science and Innovations (CLEO:S&I) 2011