Passively Aligned Flip-chip Laser Diodes using Multi-axial Slide- stop Guided Design and Laser Assisted Bonding (LAB) on a CMOS-based Optical Interposer™

Simon Chun Kiat Goh; Baochang Xu; Baochang Xu; Yu Zhang; Chun Fei Siah; Chun Fei Siah; Bo Zhao; Rappl Sebastiani; James Yong Meng Lee; Suresh Venkatesan; Aaron Voon Yew Thean; Aaron Voon Yew Thean; Yeow Kheng Lim; Yeow Kheng Lim

European Conference on Optical Communication (ECOC) 2022
Technical Digest Series (Optica Publishing Group, 2022),
paper Th2F.6

Passively Aligned Flip-chip Laser Diodes using Multi-axial Slide- stop Guided Design and Laser Assisted Bonding (LAB) on a CMOS-based Optical Interposer™

Simon Chun Kiat Goh, Baochang Xu, Yu Zhang, Chun Fei Siah, Bo Zhao, Rappl Sebastiani, James Yong Meng Lee, Suresh Venkatesan, Aaron Voon Yew Thean, and Yeow Kheng Lim

European Conference and Exhibition on Optical Communication 2022

Basel Switzerland
18–22 September 2022
ISBN: 978-1-957171-15-9

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Non-Linear Devices and Packaging (Th2F)

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S. C. K. Goh, B. Xu, Y. Zhang, C. F. Siah, B. Zhao, R. Sebastiani, J. Y. M. Lee, S. Venkatesan, A. V. Y. Thean, and Y. K. Lim, "Passively Aligned Flip-chip Laser Diodes using Multi-axial Slide- stop Guided Design and Laser Assisted Bonding (LAB) on a CMOS-based Optical Interposer™," in European Conference on Optical Communication (ECOC) 2022, J. Leuthold, C. Harder, B. Offrein, and H. Limberger, eds., Technical Digest Series (Optica Publishing Group, 2022), paper Th2F.6.

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Abstract

The incorporation of rectangular slide-stop structures improve post-bond accuracy by 1.6X achieving a best-in-class relative axial offset of 0.13µm. High-precision bonder with laser-assisted bonding capability enables heterogeneous integration of optical components with higher packing density due to a small heat-affected zone radius of 280µm.

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