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Conferences > CLEOPR > 2001 > TuE1 > TuE1_3
  • The 4th Pacific Rim Conference on Lasers and Electro-Optics
  • Technical Digest Series (Optica Publishing Group, 2001),
  • paper TuE1_3

Reduction of Alignment Shift in Flip-Chip Bonding for VSCEL Array Module Packaging

W. J. Wu, C. C. Cheng, R. H. Yuang, M. T. Chu, and W. H. Cheng

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Abstract

An optimum approach for reduction of alignment shift in flip-chip bonding for Vertical Cavity Surface Emitting Laser (VSCEL) array module package is presented. The laser array module was fabricated by the assembly of a 4-channel VSCEL array and 50/125 μm multimode fiber ribbons. The results show that the alignment shifts of flip-chip bonding under the optimum process of 20 sec bonding time and 20 g loading are minimum. The average minimum misalignments of flip-chip bonding were measured to be 1 and 5 μm for horizontal and vertical directions, respectively.

© 2001 IEEE

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