Author Affiliations

Yating Wan,^1,a) Qiang Li,^1,a) Alan Y. Liu,^2,a) Arthur C. Gossard,^2,3 John E. Bowers,^2,3 Evelyn L. Hu,⁴ and Kei May Lau^1,*

¹Department of Electronic and Computer Engineering, Hong Kong University of Science and Technology, Clear Water Bay, Kowloon, Hong Kong

²Materials Department, University of California Santa Barbara, Santa Barbara, California 93106, USA

³Department of Electrical and Computer Engineering, University of California Santa Barbara, Santa Barbara, California 93106, USA

⁴School of Engineering and Applied Sciences, Harvard University, Cambridge, MA 02138, USA

^a)Y. Wan, Q. Li, and A. Y. Liu contributed equally to this work

^*Corresponding author: eekmlau@ust.hk