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Conferences > CLEO_AT > 2021 > AM1R > AM1R.2

Hyperspectral Imaging Reflectometry for 3D Semiconductor Metrology

Jinseob Kim, Gwangsik Park, Daehoon Han, Wookrae Kim, and Myungjun Lee

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Abstract

We present the hyperspectral imaging reflectometry technique for the critical dimension measurement of the advanced semiconductor devices. The proposed line scan based broadband system can enable high speed & non-destructive 3D measurements with great precision.

© 2021 The Author(s)

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