Edge photodiode hybrided on Si motherboard for 2.5 Gb/s low cost photoreception

F. Blache; E. Boucherez; D. Carpentier; F. Devaux; C. Duchemin; D. Ferling; D. Ferling; L. Giraudet; A. Goeth; A. Goeth; J. M. Hayano; W. Jörg; W. Jörg; J. Kabs; J. Kabs; S. Kerboeuf; J. Landreau; V. Lecoq; V. Lecoq; R. Lefèvre; S. Louis; A. Muller; A. Muller; P. Pagnod; P. Peloso; S. Rabaron; S. Rabaron; A. Stumpf; A. Stumpf; G. Wanlin; G. Wanlin

The 4th Pacific Rim Conference on Lasers and Electro-Optics
Technical Digest Series (Optica Publishing Group, 2001),
paper TuE1_5

Edge photodiode hybrided on Si motherboard for 2.5 Gb/s low cost photoreception

F. Blache, E. Boucherez, D. Carpentier, F. Devaux, C. Duchemin, D. Ferling, L. Giraudet, A. Goeth, J. M. Hayano, W. Jörg, J. Kabs, S. Kerboeuf, J. Landreau, V. Lecoq, R. Lefèvre, S. Louis, A. Muller, P. Pagnod, P. Peloso, S. Rabaron, A. Stumpf, and G. Wanlin

Conference on Lasers and Electro-Optics/Pacific Rim 2001

Chiba Japan
15–19 July 2001
ISBN:

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Integration and Packaging [Room E] (TuE1)

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F. Blache, E. Boucherez, D. Carpentier, F. Devaux, C. Duchemin, D. Ferling, L. Giraudet, A. Goeth, J. M. Hayano, W. Jörg, J. Kabs, S. Kerboeuf, J. Landreau, V. Lecoq, R. Lefèvre, S. Louis, A. Muller, P. Pagnod, P. Peloso, S. Rabaron, A. Stumpf, and G. Wanlin, "Edge photodiode hybrided on Si motherboard for 2.5 Gb/s low cost photoreception," in The 4th Pacific Rim Conference on Lasers and Electro-Optics, Technical Digest Series (Optica Publishing Group, 2001), paper TuE1_5.

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Abstract

A low cost integration technology has been developed to assemble 2.5 and 10 Gb/s photodiodes. It relies on flip-chiped devices with lensed fibres positioned in V-grooves. For 2.5 Gb/s the photodiode, the fibre and the transimpedance amplifier are integrated on a single Si motherboard compatible with mounting in a mini-dil module. The sensitivity is −23.5 dBm at 10⁻¹⁰ BER with no error floor.

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