Abstract

For the spread of optical fiber networks to homes and businesses, low cost packaging of laser diode modules is particularly desired because normal active alignment of laser to fiber is very complex assembly manner. To realize a low cost assembly, hybrid integration using silicon waferboard has been applied to optical coupling between arrayed lasers and fibers without any active alignment.^1,2 However, application of this technology to single-channel modules requires more precise laser positioning, particularly rotate direction on silicon surface, than an arrayed laser. In this paper, we propose a new assembly technique for high precise positioning and fixing of a single laser on silicon substrate, and easy passive coupling with good uniformity has been attained.

© 1995 IEEE