Abstract

Hybrid integration utilizing silicon waferboard as a platform for mounting discrete and array components, is an attractive alternative to using conventional sub-mounted devices when building low-cost, high-performance, multichannel optical transmitter and receiver modules. Silicon substrates are extremely versadle as a platform material for the following reasons: 1) both multimode and single mode fiber can be mounted into v-grooves etched into the silicon surface; 2) alignment fiduciaU formed on the silicon surface, provide a registration feature for optoelectronic devices such as emitters and detectors; 3) signal traces can be defined using conventional photo-lithography techniques on a common silicon substrate; one that carries the components as well as the optical fibers; and 4), heat can be efficiently transported away from the active devices mounted on the silicon surface through die silicon platform.

© 1996 Optical Society of America