Abstract
© 2016 Optical Society of Korea
PDF Article© 2016 Optical Society of Korea
PDF Article
T. L. Jin, N. S. Ha, and N. S. Goo, “A study of the thermal buckling behavior of a circular aluminum plate using the digital image correlation technique and finite element analysis,” Thin-Walled Structures, 77, 187-197 (2014).
[Crossref]
X. B. Yang, Z. W. Liu, and H. M. Xie, “A real time deformation evaluation method for surface and interface of thermal barrier coatings during 1100°C thermal shock,” Meas. Sci. Technol. 23, 105604-105615 (2012).
[Crossref]
B. Pan, D. F. Wu, Z. Y. Wang, and Y. Xia, “High-temperature digital image correlation method for full-field deformation measurement at 1200°C,” Meas. Sci. Technol. 22, 015701-11 (2011).
[Crossref]
B. Pan, D. F. Wu, and Y. Xia, “High-temperature field measurement by combing transient aerodynamic heating system and reliability- guided digital image correlation,” Opt. Lasers Eng. 48, 841-848 (2010).
[Crossref]
B. M. B. Grant, H. J. Stone, P. J. Withers, and M. Preuss, “High-temperature strain field measurement using digital image correlation,” J. Strain. Anal. Eng. Des. 44, 263-271 (2009).
[Crossref]
Z. Wang, A. C. Bovik, H. R. Sheikh, and E. P. Simoncelli “Image quality assessment: from error visibility to structural similarity,” IEEE Trans. Image Process. 13, 600-612 (2004).
[Crossref]
J. Y. Liu and M. Iskander, “Adaptive cross correlation for imaging displacements in soils,” J. Comput. Civil Eng. 18, 46-57 (2004).
[Crossref]
D. M. Tsai and C. T. Lin, “Fast normalized cross correlation for defect detection,” Pattern Recognit. Lett. 24, 2625–2631 (2003).
M. Anwander, B. G. Zagar, B. Weiss, and H. Weiss, “Noncontacting strain measurements at high temperatures by the digital laser speckle technique,” Exp. Mech. 40, 98-105 (2000).
[Crossref]
L. X. Zhao, “Thermal-Optical Evaluation to Optical Windows of Space Camera,” Acta Optica Sinica 18, 1440-1444 (1998).
J. S. Lyons, J. Liu, and M. A. Sutton, “High-temperature deformation measurement using digital image correlation,” Exp. Mech. 36, 64-70 (1996).
[Crossref]
B. Han, Y. Guo, B. Han, and Y. Guo, “Thermal Deformation Analysis of Various Electronic Packaging Products by Moiré and Microscopic Moiré Interferometry,” J. Electron. Packaging 117, 185-92 (1995).
[Crossref]
D. L. Donoho and J. M. Johnsotne, “Ideal spatial adaptation via wavelet shrinkage,” Biometrika, 81, 425-455 (1994).
[Crossref]
D. Post and J. D. Wood. “Determination of thermal strains by moiré interferometry,” Exp. Mech. 29, 318-22 (1989).
[Crossref]
J. T. Malmo, O. J. Lokverg, and G. A. Slettemoen, “Interferometric Testing at Very High Temperatures by TV Holography (ESPI),” Exp. Mech. 28, 315-321 (1988).
[Crossref]
T.Chu, W.Ranson and M.A.Sutton, “Applications of digital-image-correlation techniques to experimental mechanics,” Exp. Mech. 25, 232-244 (1985).
[Crossref]
W. H. Peters and W. F. Ranson, “Digital imaging techniques in experimental stress analysis,” Opt. Eng. 21, 427-431 (1981).
M. Anwander, B. G. Zagar, B. Weiss, and H. Weiss, “Noncontacting strain measurements at high temperatures by the digital laser speckle technique,” Exp. Mech. 40, 98-105 (2000).
[Crossref]
W. P. Bames, “Some effects of aerospace thermal environments on high-acuity optical systems,” Appl. Opt., 5, 671-675 (1966).
[Crossref]
Z. Wang, A. C. Bovik, H. R. Sheikh, and E. P. Simoncelli “Image quality assessment: from error visibility to structural similarity,” IEEE Trans. Image Process. 13, 600-612 (2004).
[Crossref]
T.Chu, W.Ranson and M.A.Sutton, “Applications of digital-image-correlation techniques to experimental mechanics,” Exp. Mech. 25, 232-244 (1985).
[Crossref]
D. L. Donoho and J. M. Johnsotne, “Ideal spatial adaptation via wavelet shrinkage,” Biometrika, 81, 425-455 (1994).
[Crossref]
T. L. Jin, N. S. Ha, and N. S. Goo, “A study of the thermal buckling behavior of a circular aluminum plate using the digital image correlation technique and finite element analysis,” Thin-Walled Structures, 77, 187-197 (2014).
[Crossref]
B. M. B. Grant, H. J. Stone, P. J. Withers, and M. Preuss, “High-temperature strain field measurement using digital image correlation,” J. Strain. Anal. Eng. Des. 44, 263-271 (2009).
[Crossref]
B. Han, Y. Guo, B. Han, and Y. Guo, “Thermal Deformation Analysis of Various Electronic Packaging Products by Moiré and Microscopic Moiré Interferometry,” J. Electron. Packaging 117, 185-92 (1995).
[Crossref]
B. Han, Y. Guo, B. Han, and Y. Guo, “Thermal Deformation Analysis of Various Electronic Packaging Products by Moiré and Microscopic Moiré Interferometry,” J. Electron. Packaging 117, 185-92 (1995).
[Crossref]
T. L. Jin, N. S. Ha, and N. S. Goo, “A study of the thermal buckling behavior of a circular aluminum plate using the digital image correlation technique and finite element analysis,” Thin-Walled Structures, 77, 187-197 (2014).
[Crossref]
B. Han, Y. Guo, B. Han, and Y. Guo, “Thermal Deformation Analysis of Various Electronic Packaging Products by Moiré and Microscopic Moiré Interferometry,” J. Electron. Packaging 117, 185-92 (1995).
[Crossref]
B. Han, Y. Guo, B. Han, and Y. Guo, “Thermal Deformation Analysis of Various Electronic Packaging Products by Moiré and Microscopic Moiré Interferometry,” J. Electron. Packaging 117, 185-92 (1995).
[Crossref]
R. Thompson and K. Hemker, “Thermal expansion measurements on coating materials by digital image correlation,” In Proc 2007 SEM Annual Conference and Exposition on Experimental and Applied Mechanics (Springfield, MA, USA, Jun. 2007).
J. Y. Liu and M. Iskander, “Adaptive cross correlation for imaging displacements in soils,” J. Comput. Civil Eng. 18, 46-57 (2004).
[Crossref]
T. L. Jin, N. S. Ha, and N. S. Goo, “A study of the thermal buckling behavior of a circular aluminum plate using the digital image correlation technique and finite element analysis,” Thin-Walled Structures, 77, 187-197 (2014).
[Crossref]
D. L. Donoho and J. M. Johnsotne, “Ideal spatial adaptation via wavelet shrinkage,” Biometrika, 81, 425-455 (1994).
[Crossref]
D. M. Tsai and C. T. Lin, “Fast normalized cross correlation for defect detection,” Pattern Recognit. Lett. 24, 2625–2631 (2003).
J. S. Lyons, J. Liu, and M. A. Sutton, “High-temperature deformation measurement using digital image correlation,” Exp. Mech. 36, 64-70 (1996).
[Crossref]
J. Y. Liu and M. Iskander, “Adaptive cross correlation for imaging displacements in soils,” J. Comput. Civil Eng. 18, 46-57 (2004).
[Crossref]
X. B. Yang, Z. W. Liu, and H. M. Xie, “A real time deformation evaluation method for surface and interface of thermal barrier coatings during 1100°C thermal shock,” Meas. Sci. Technol. 23, 105604-105615 (2012).
[Crossref]
J. T. Malmo, O. J. Lokverg, and G. A. Slettemoen, “Interferometric Testing at Very High Temperatures by TV Holography (ESPI),” Exp. Mech. 28, 315-321 (1988).
[Crossref]
J. S. Lyons, J. Liu, and M. A. Sutton, “High-temperature deformation measurement using digital image correlation,” Exp. Mech. 36, 64-70 (1996).
[Crossref]
J. T. Malmo, O. J. Lokverg, and G. A. Slettemoen, “Interferometric Testing at Very High Temperatures by TV Holography (ESPI),” Exp. Mech. 28, 315-321 (1988).
[Crossref]
B. Pan, D. F. Wu, Z. Y. Wang, and Y. Xia, “High-temperature digital image correlation method for full-field deformation measurement at 1200°C,” Meas. Sci. Technol. 22, 015701-11 (2011).
[Crossref]
B. Pan, D. F. Wu, and Y. Xia, “High-temperature field measurement by combing transient aerodynamic heating system and reliability- guided digital image correlation,” Opt. Lasers Eng. 48, 841-848 (2010).
[Crossref]
W. H. Peters and W. F. Ranson, “Digital imaging techniques in experimental stress analysis,” Opt. Eng. 21, 427-431 (1981).
D. Post and J. D. Wood. “Determination of thermal strains by moiré interferometry,” Exp. Mech. 29, 318-22 (1989).
[Crossref]
B. M. B. Grant, H. J. Stone, P. J. Withers, and M. Preuss, “High-temperature strain field measurement using digital image correlation,” J. Strain. Anal. Eng. Des. 44, 263-271 (2009).
[Crossref]
T.Chu, W.Ranson and M.A.Sutton, “Applications of digital-image-correlation techniques to experimental mechanics,” Exp. Mech. 25, 232-244 (1985).
[Crossref]
W. H. Peters and W. F. Ranson, “Digital imaging techniques in experimental stress analysis,” Opt. Eng. 21, 427-431 (1981).
F. Yang, Y. L. Zhang, and Y. N. Ren, “The welding of the new type heat-resisting steel,” China Electric Power Press, 105-106 (2006).
Z. Wang, A. C. Bovik, H. R. Sheikh, and E. P. Simoncelli “Image quality assessment: from error visibility to structural similarity,” IEEE Trans. Image Process. 13, 600-612 (2004).
[Crossref]
Z. Wang, A. C. Bovik, H. R. Sheikh, and E. P. Simoncelli “Image quality assessment: from error visibility to structural similarity,” IEEE Trans. Image Process. 13, 600-612 (2004).
[Crossref]
J. T. Malmo, O. J. Lokverg, and G. A. Slettemoen, “Interferometric Testing at Very High Temperatures by TV Holography (ESPI),” Exp. Mech. 28, 315-321 (1988).
[Crossref]
B. M. B. Grant, H. J. Stone, P. J. Withers, and M. Preuss, “High-temperature strain field measurement using digital image correlation,” J. Strain. Anal. Eng. Des. 44, 263-271 (2009).
[Crossref]
J. S. Lyons, J. Liu, and M. A. Sutton, “High-temperature deformation measurement using digital image correlation,” Exp. Mech. 36, 64-70 (1996).
[Crossref]
T.Chu, W.Ranson and M.A.Sutton, “Applications of digital-image-correlation techniques to experimental mechanics,” Exp. Mech. 25, 232-244 (1985).
[Crossref]
R. Thompson and K. Hemker, “Thermal expansion measurements on coating materials by digital image correlation,” In Proc 2007 SEM Annual Conference and Exposition on Experimental and Applied Mechanics (Springfield, MA, USA, Jun. 2007).
D. M. Tsai and C. T. Lin, “Fast normalized cross correlation for defect detection,” Pattern Recognit. Lett. 24, 2625–2631 (2003).
Z. Wang, A. C. Bovik, H. R. Sheikh, and E. P. Simoncelli “Image quality assessment: from error visibility to structural similarity,” IEEE Trans. Image Process. 13, 600-612 (2004).
[Crossref]
B. Pan, D. F. Wu, Z. Y. Wang, and Y. Xia, “High-temperature digital image correlation method for full-field deformation measurement at 1200°C,” Meas. Sci. Technol. 22, 015701-11 (2011).
[Crossref]
M. Anwander, B. G. Zagar, B. Weiss, and H. Weiss, “Noncontacting strain measurements at high temperatures by the digital laser speckle technique,” Exp. Mech. 40, 98-105 (2000).
[Crossref]
M. Anwander, B. G. Zagar, B. Weiss, and H. Weiss, “Noncontacting strain measurements at high temperatures by the digital laser speckle technique,” Exp. Mech. 40, 98-105 (2000).
[Crossref]
B. M. B. Grant, H. J. Stone, P. J. Withers, and M. Preuss, “High-temperature strain field measurement using digital image correlation,” J. Strain. Anal. Eng. Des. 44, 263-271 (2009).
[Crossref]
D. Post and J. D. Wood. “Determination of thermal strains by moiré interferometry,” Exp. Mech. 29, 318-22 (1989).
[Crossref]
B. Pan, D. F. Wu, Z. Y. Wang, and Y. Xia, “High-temperature digital image correlation method for full-field deformation measurement at 1200°C,” Meas. Sci. Technol. 22, 015701-11 (2011).
[Crossref]
B. Pan, D. F. Wu, and Y. Xia, “High-temperature field measurement by combing transient aerodynamic heating system and reliability- guided digital image correlation,” Opt. Lasers Eng. 48, 841-848 (2010).
[Crossref]
B. Pan, D. F. Wu, Z. Y. Wang, and Y. Xia, “High-temperature digital image correlation method for full-field deformation measurement at 1200°C,” Meas. Sci. Technol. 22, 015701-11 (2011).
[Crossref]
B. Pan, D. F. Wu, and Y. Xia, “High-temperature field measurement by combing transient aerodynamic heating system and reliability- guided digital image correlation,” Opt. Lasers Eng. 48, 841-848 (2010).
[Crossref]
X. B. Yang, Z. W. Liu, and H. M. Xie, “A real time deformation evaluation method for surface and interface of thermal barrier coatings during 1100°C thermal shock,” Meas. Sci. Technol. 23, 105604-105615 (2012).
[Crossref]
F. Yang, Y. L. Zhang, and Y. N. Ren, “The welding of the new type heat-resisting steel,” China Electric Power Press, 105-106 (2006).
X. B. Yang, Z. W. Liu, and H. M. Xie, “A real time deformation evaluation method for surface and interface of thermal barrier coatings during 1100°C thermal shock,” Meas. Sci. Technol. 23, 105604-105615 (2012).
[Crossref]
M. Anwander, B. G. Zagar, B. Weiss, and H. Weiss, “Noncontacting strain measurements at high temperatures by the digital laser speckle technique,” Exp. Mech. 40, 98-105 (2000).
[Crossref]
F. Yang, Y. L. Zhang, and Y. N. Ren, “The welding of the new type heat-resisting steel,” China Electric Power Press, 105-106 (2006).
L. X. Zhao, “Thermal-Optical Evaluation to Optical Windows of Space Camera,” Acta Optica Sinica 18, 1440-1444 (1998).
L. X. Zhao, “Thermal-Optical Evaluation to Optical Windows of Space Camera,” Acta Optica Sinica 18, 1440-1444 (1998).
W. P. Bames, “Some effects of aerospace thermal environments on high-acuity optical systems,” Appl. Opt., 5, 671-675 (1966).
[Crossref]
D. L. Donoho and J. M. Johnsotne, “Ideal spatial adaptation via wavelet shrinkage,” Biometrika, 81, 425-455 (1994).
[Crossref]
T.Chu, W.Ranson and M.A.Sutton, “Applications of digital-image-correlation techniques to experimental mechanics,” Exp. Mech. 25, 232-244 (1985).
[Crossref]
M. Anwander, B. G. Zagar, B. Weiss, and H. Weiss, “Noncontacting strain measurements at high temperatures by the digital laser speckle technique,” Exp. Mech. 40, 98-105 (2000).
[Crossref]
D. Post and J. D. Wood. “Determination of thermal strains by moiré interferometry,” Exp. Mech. 29, 318-22 (1989).
[Crossref]
J. T. Malmo, O. J. Lokverg, and G. A. Slettemoen, “Interferometric Testing at Very High Temperatures by TV Holography (ESPI),” Exp. Mech. 28, 315-321 (1988).
[Crossref]
J. S. Lyons, J. Liu, and M. A. Sutton, “High-temperature deformation measurement using digital image correlation,” Exp. Mech. 36, 64-70 (1996).
[Crossref]
Z. Wang, A. C. Bovik, H. R. Sheikh, and E. P. Simoncelli “Image quality assessment: from error visibility to structural similarity,” IEEE Trans. Image Process. 13, 600-612 (2004).
[Crossref]
J. Y. Liu and M. Iskander, “Adaptive cross correlation for imaging displacements in soils,” J. Comput. Civil Eng. 18, 46-57 (2004).
[Crossref]
B. Han, Y. Guo, B. Han, and Y. Guo, “Thermal Deformation Analysis of Various Electronic Packaging Products by Moiré and Microscopic Moiré Interferometry,” J. Electron. Packaging 117, 185-92 (1995).
[Crossref]
B. M. B. Grant, H. J. Stone, P. J. Withers, and M. Preuss, “High-temperature strain field measurement using digital image correlation,” J. Strain. Anal. Eng. Des. 44, 263-271 (2009).
[Crossref]
B. Pan, D. F. Wu, Z. Y. Wang, and Y. Xia, “High-temperature digital image correlation method for full-field deformation measurement at 1200°C,” Meas. Sci. Technol. 22, 015701-11 (2011).
[Crossref]
X. B. Yang, Z. W. Liu, and H. M. Xie, “A real time deformation evaluation method for surface and interface of thermal barrier coatings during 1100°C thermal shock,” Meas. Sci. Technol. 23, 105604-105615 (2012).
[Crossref]
W. H. Peters and W. F. Ranson, “Digital imaging techniques in experimental stress analysis,” Opt. Eng. 21, 427-431 (1981).
B. Pan, D. F. Wu, and Y. Xia, “High-temperature field measurement by combing transient aerodynamic heating system and reliability- guided digital image correlation,” Opt. Lasers Eng. 48, 841-848 (2010).
[Crossref]
D. M. Tsai and C. T. Lin, “Fast normalized cross correlation for defect detection,” Pattern Recognit. Lett. 24, 2625–2631 (2003).
T. L. Jin, N. S. Ha, and N. S. Goo, “A study of the thermal buckling behavior of a circular aluminum plate using the digital image correlation technique and finite element analysis,” Thin-Walled Structures, 77, 187-197 (2014).
[Crossref]
R. Thompson and K. Hemker, “Thermal expansion measurements on coating materials by digital image correlation,” In Proc 2007 SEM Annual Conference and Exposition on Experimental and Applied Mechanics (Springfield, MA, USA, Jun. 2007).
F. Yang, Y. L. Zhang, and Y. N. Ren, “The welding of the new type heat-resisting steel,” China Electric Power Press, 105-106 (2006).
OSA participates in Crossref's Cited-By Linking service. Citing articles from OSA journals and other participating publishers are listed here.