Abstract

To measure the depth and diameter of through silicon vias simultaneously, a novel method based on spectral-domain interferometer and confocal microscope is proposed and realized. Most parts of the measurement system are constructed with optical fiber components for flexible configuration and easy alignment. According to the measurement results and performance evaluation, the mean values of the diameter and depth were 6.07m and 48.255m with the expanded uncertainties of 0.20m ( $k\,= \,{\text{2}}$ ) and 37nm ( $k\,= \,{\text{2}}$ ), respectively.

© 2016 IEEE