Abstract

We demonstrate an optical method for 3D profilometry of micro-nano devices with large step structures. The measurement principle is based on a dual-comb direct time-of-flight detection. An electronically controlled optical sampling (ECOPS) approach is used to improve the acquisition rate. In a proof-of-principle distance measurement experiment, the measurement precision reaches 15 nm at 4000-times averages. The method has been used to characterize the profile of a large aspect-ratio rectangular micron-groove with 10 µm width and 62.3 µm depth. By point-by-point scanning, a 3D point cloud image is obtained, and the 3D profile of the micro-structure is quantitatively reconstructed with sub-micrometer precision. The proposed high-precision, high-speed surface 3D profile measurement technology could be applied to profilometry and inspection of complex microelectronics devices in the future.

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