Abstract

Wafer alignment is the core technique of lithographic tools. Image-processing-based wafer alignment techniques are commonly used in lithographic tools. An alignment algorithm is used to analyze the alignment mark image for obtaining the mark position. The accuracy and speed of the alignment algorithm are very important for guaranteeing the overlay and throughput of lithographic tools. The most commonly used algorithm in image-processing-based alignment techniques is the self-correlation method. This method has a high accuracy, but the calculation is complex, and the calculation speed is slow. In this paper, we propose a sub-pixel position estimation algorithm based on Gaussian fitting and sampling theorem interpolation. The algorithm first reconstructs the alignment signal by sampling theorem interpolation and then obtains the sub-pixel position of the mark by Gaussian fitting. The accuracy and robustness of the algorithm are verified by testing the simulated marks and experimentally captured marks. The repeat accuracy can reach 1/100 pixels, which is in the same level with the self-correlation method. The calculation speed is highly improved compared with the self-correlation method, which needs only about 1/3 of even short calculation time.

© 2021 Optical Society of America

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