GaN µLED on 200mm Silicon Wafer toward Efficient Chip to Chip Communication

P. Le Maitre; S. El Badaoui; A. Cibié; J. Simon; F. Rol; B. Miralles; B. Aventurier; C. Ballot; S. Poncet; P. De Martino

doi:10.1364/SELED.2023.SW2D.3

Advanced Photonics Congress 2023
Technical Digest Series (Optica Publishing Group, 2023),
paper SW2D.3
•https://doi.org/10.1364/SELED.2023.SW2D.3

GaN µLED on 200mm Silicon Wafer toward Efficient Chip to Chip Communication

P. Le Maitre, S. El Badaoui, A. Cibié, J. Simon, F. Rol, B. Miralles, B. Aventurier, C. Ballot, S. Poncet, and P. De Martino

Solar Energy and Light-Emitting Devices 2023

Busan Republic of Korea
9–13 July 2023
ISBN: 978-1-957171-26-5

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Anorganic LED (SW2D)

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P. Le Maitre, S. El Badaoui, A. Cibié, J. Simon, F. Rol, B. Miralles, B. Aventurier, C. Ballot, S. Poncet, and P. De Martino, "GaN µLED on 200mm Silicon Wafer toward Efficient Chip to Chip Communication," in Advanced Photonics Congress 2023, Technical Digest Series (Optica Publishing Group, 2023), paper SW2D.3.

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Abstract

We present experimental study of emission and reception of GaN µLED fabricated in a 200mm GaN-on-Si process compatible with ASIC monolithic integration, targeting energy efficient chip-to-chip communication through imaging fiber.

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