Abstract

Conventional thin film deposition monitoring techniques in use today have several limitations. They generally give information on either mechanical thickness (quartz crystal monitoring) or on optical thickness (photometric monitoring) but not on both simultaneously. These techniques usually require extrapolation of the thickness being deposited on a remote substrate (or crystal) to the thickness being deposited on the substrate to be coated. Errors arise due to changing process parameters such as vapor distribution patterns, temperatures and pressures.

© 1984 Optical Society of America