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Conferences > OFC > 2023 > W2A > W2A.8

Enhancement of Bandwidth-Responsivity Product in High-Speed Avalanche Photodiodes with Optimized Flip-Chip Bonding Package for Coherent Detection

Naseem, Nan-Wei Chen, Syed Hasan Parvez, Zohauddin Ahmad, Sean Yang, H.-S. Chen, Hsiang-Szu Chang, Jack Jia-Sheng Huang, and Jin-Wei Shi

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Abstract

Flip-chip bonding APDs with 14µm window diameters are demonstrated. Wide-bandwidth (36GHz), high-responsivity (3.4A/W), low dark current (175nA) and high MMW output power (-1dBm at 40GHz) can be achieved simultaneously with 12.5mA Isat under 0.9Vbr.

© 2023 The Author(s)

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