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Conferences > OFC > 2022 > M3D > M3D.3

1060nm Single-mode Transverse Coupled Cavity VCSEL with Surface Relief Engineering for 80Gbps PAM4 Modulation

Shanting Hu, Xiaodong Gu, Hameeda R Ibrahim, Masanori Nakahama, Satoshi Shinada, and Fumio Koyama

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Abstract

We demonstrate 1060nm VCSELs with surface relief engineering, providing transverse-resonance in transverse-coupled cavity VCSELs, which enables single-mode operation and bandwidth enhancement. We obtained a large signal modulation of 54 Gbps NRZ and 80 Gbps PAM4.

© 2022 The Author(s)

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