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Conferences > OFC > 2021 > F2F > F2F.2

Silicon Photonic Based Stacked Die Assembly for 4×200-Gbit/s Short-Reach Transmission

Ying Zhao, Li Chen, Ricardo Aroca, Ninghui Zhu, Dinh Ton, David Inglis, and Christopher Doerr

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Abstract

We present a silicon photonic based stacked die assembly with driver and transimpedance amplifier for 4×200-Gbps applications. Various 200-Gbps pulse amplitude modulation formats over 2 and 10.5-km transmissions are demonstrated and compared.

© 2021 The Author(s)

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