Embracing Diversity: Interconnecting different materials and components for the lowest $/Gb

Bardia Pezeshki

doi:10.1364/OFC.2015.W3H.5

Optical Fiber Communication Conference
OSA Technical Digest (online) (Optica Publishing Group, 2015),
paper W3H.5
•https://doi.org/10.1364/OFC.2015.W3H.5

Embracing Diversity: Interconnecting different materials and components for the lowest $/Gb

Bardia Pezeshki

Optical Fiber Communication Conference 2015

Los Angeles, California United States
22–26 March 2015
ISBN: 978-1-55752-937-4

From the session
Beyond the Gold Box: The Future of Integrated Optics II (W3H)

Not Accessible

Your library or personal account may give you access

Get PDF
Email
Share
Get Citation
Copy Citation Text
B. Pezeshki, "Embracing Diversity: Interconnecting different materials and components for the lowest $/Gb," in Optical Fiber Communication Conference, OSA Technical Digest (online) (Optica Publishing Group, 2015), paper W3H.5.

Export Citation
- BibTex
- Endnote (RIS)
- HTML
- Plain Text
Citation alert
Save article

Abstract

Highest performance and lowest cost optical functions are best obtained in the shortest time by using proven and mature building blocks. We show the use of a MEMS breadboard to interconnect glass PLCs, InP lasers, and silicon photonics for a variety of functions.

PDF Article

More Like This

Multi-wavelength 100Gb/s Silicon Photonics Based Transceiver with Silica mux/demux and MEMS-coupled InP Lasers

Lucas Soldano, Jay Kubicky, Dinh Ton, Jozef Wendland, Margaret Allen, Andrew Grant, and Bardia Pezeshki
Th3B.1 Optical Fiber Communication Conference (OFC) 2017

The Advantages of Hybrid Optical Integration, as Demonstrated by a 4x25Gb/s Transceiver (TROSA)

Bardia Pezeshki
M3B.3 Optical Fiber Communication Conference (OFC) 2017

Progress in InP-based Photonic Integration

Meint K. Smit
FW5B.4 Frontiers in Optics (FiO) 2015

Previous Article Next Article