Compact and High-Density Opto-electronic Transceiver Module for Chip-to-Chip Optical Interconnects

Tetsuya Mori; Makoto Fujiwara; Shinsuke Terada; Koji Choki

doi:10.1364/OFC.2011.OThG5

Optical Fiber Communication Conference/National Fiber Optic Engineers Conference 2011
OSA Technical Digest (CD) (Optica Publishing Group, 2011),
paper OThG5
•https://doi.org/10.1364/OFC.2011.OThG5

Compact and High-Density Opto-electronic Transceiver Module for Chip-to-Chip Optical Interconnects

Tetsuya Mori, Makoto Fujiwara, Shinsuke Terada, and Koji Choki

Optical Fiber Communication Conference 2011

Los Angeles, California United States
6–10 March 2011
ISBN: 978-1-55752-906-0

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VCSELS & Transmitters (OThG)

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T. Mori, M. Fujiwara, S. Terada, and K. Choki, "Compact and High-Density Opto-electronic Transceiver Module for Chip-to-Chip Optical Interconnects," in Optical Fiber Communication Conference/National Fiber Optic Engineers Conference 2011, OSA Technical Digest (CD) (Optica Publishing Group, 2011), paper OThG5.

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Abstract

We fabricated an opto-electronic transceiver module on a flexible printed circuit board without using a lens array. 10Gbps data transmission through polynorbornene-based waveguide is achieved with low inter-channel cross talk.

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