Abstract

We review our recent results on Si or III-V integrated devices in novel transmitter architectures for IM-DD dispersion-uncompensated links. Methods relying on chirp engineering or SSB generation are demonstrated for multi- and single-carrier modulation formats.

© 2018 The Author(s)

PDF Article

References

You do not have subscription access to this journal. Citation lists with outbound citation links are available to subscribers only. You may subscribe either as an OSA member, or as an authorized user of your institution.

Contact your librarian or system administrator
or
Login to access OSA Member Subscription