Abstract

Laser processing at micrometer and sub-micrometer resolutions is becoming more prominent, driving the equipment used for these processes to meet more demanding specifications. Two-photon polymerization (2PP), selective laser etching of glass and laser micro-machining are emerging processes that fall into this category. They rely on ultrafast lasers in the femtosecond pulse width range that are focused with high numerical aperture focusing optics to achieve sub-micrometer spot size. The small spot size enables impressive processing resolution, but it also creates real challenges for positioning such a small beam and allowing that beam to make large enough parts for practical applications.

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