Abstract
Transparent materials such as glass and sapphire are ubiquitous in modern technology. They are used for consumer electronics, substrates for microsystems, microchips, and encapsulation. However, most of the intended uses require deep drilling, which is extremely demanding for lithography. In this framework, ultrafast laser pulses are ideal since they allow materials to be processed in 3 dimensions from the material’s bulk. In this context, Bessel beams provide novel opportunities for laser processing of transparent materials at an extremely high aspect ratio.
© 2022 Japan Society of Applied Physics, Optica Publishing Group
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