Abstract

The performance of future generation data processing systems will be set by intra-multi-chip-module (intra-MCM) interconnect limitations rather than by the processing performance of the CMOS IC's within these modules. Optical inputs/outputs (I/O) over the entire chip area is pursued as a solution to these interconnection problems in the European Community funded ESPRIT project “Optically Interconnected Integrated Circuits” (OIIC). With this approach, two dimensional (2D) parallel data transfer will be made possible through the use of opto-electronic emitter and receiver arrays, flip-chip mounted on CMOS circuitry, and interconnected by passive optical pathway blocks. At the source side of the optical interconnection, both Vertical Cavity Surface Emitting Lasers (VCSELs) and Micro-Cavity Light Emitting Diodes (MCLEDs) [1] are considered. As receivers InP detector arrays are considered. For the optical pathways, two approaches are explored. As a principal choice in this project, a 2D array of small diameter Plastic Optical Fibers (POFs) is used as a flexible transmission medium. As an alternative to this POF-based guided-wave interconnection approach the construction of a free-space optical pathway block is pursued. Manufacturable, high-precision monolithic plastic micro-optical pathway blocks are fabricated using deep proton irradiation as a deep etch lithographic technique [2]. They integrate microlenses and micromirrors to optically interconnect the flip-chip mounted surface-normal transmitters and receivers.

© 1998 Optical Society of America