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Before the potential for large scale use of guided wave devices can be realized, low-loss and lowcost methods for fiber attachment must be developed. Several years ago, this problem was addressed by the flip-chip approach1 in which the waveguide substrate was placed on a silicon chip and aligned to fiber holding grooves. The flip-chip method has given way in recent years to the end-face-coupled method2–4 in which an array of fibers in a silicon chip is butt-joined to the guided wave device. This latter method has been demonstrated for large arrays with excess losses approaching the theoretical minimum.2 Unfortunately, this method requires the time-consuming and tedious alignment of six degrees of freedom.
© 1986 Optical Society of America
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