The Evolution of Moore’s Law and Opportunities for the Use of X-ray Systems to Analyze Advanced Semiconductor Packages

Thomas Gregorich; Johannes Ruoff

doi:10.1364/EUVXRAY.2020.EW3A.1

OSA High-brightness Sources and Light-driven Interactions Congress 2020 (EUVXRAY, HILAS, MICS)
OSA Technical Digest (Optica Publishing Group, 2020),
paper EW3A.1
•https://doi.org/10.1364/EUVXRAY.2020.EW3A.1

The Evolution of Moore’s Law and Opportunities for the Use of X-ray Systems to Analyze Advanced Semiconductor Packages

Thomas Gregorich and Johannes Ruoff

Compact EUV & X-ray Light Sources 2020

Washington, DC United States
16–20 November 2020
ISBN: 978-1-943580-73-6

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Metrology and Other Applications (EW3A)

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T. Gregorich and J. Ruoff, "The Evolution of Moore’s Law and Opportunities for the Use of X-ray Systems to Analyze Advanced Semiconductor Packages," in OSA High-brightness Sources and Light-driven Interactions Congress 2020 (EUVXRAY, HILAS, MICS), L. Assoufid, P. Naulleau, M. Couprie, T. Ishikawa, J. Rocca, C. Haefner, G. Sansone, T. Metzger, F. Quéré, M. Ebrahim-Zadeh, A. Helmy, F. Laurell, and G. Leo, eds., OSA Technical Digest (Optica Publishing Group, 2020), paper EW3A.1.

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Abstract

Moore’s Law is not dead but it is changing and as a result higher-density package interconnects are needed. We will explain the challenges creating these interconnects, how X-ray could fill the inspection and metrology gaps, and overview the requirements.

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