Abstract
We report silicon lateral MOS-capacitor modulators integrated within different thickness SOI wafers. The MZI modulators with lumped 2-segment electrodes are flip-chip bonded with CMOS drivers showing capability of 50 Gbaud PAM-4 transmission with 4 dB extinction ratio, 1.74 dB TDECQ and 2.4 pJ/bit power consumption.
© 2022 The Author(s)
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