128 Tb/s SDM Optical Interconnect for a Spine-Leaf Datacenter Network with Spatial Channel Connectivity

Ruben S. Luis; Benjamin J. Puttnam; Georg Rademacher; Satoshi Shinada; Tetsuya Hayashi; Tetsuya Nakanishi; Yuki Saito; Tetsu Morishima; Hideaki Furukawa

European Conference on Optical Communication (ECOC) 2022
Technical Digest Series (Optica Publishing Group, 2022),
paper Th2D.2

128 Tb/s SDM Optical Interconnect for a Spine-Leaf Datacenter Network with Spatial Channel Connectivity

Ruben S. Luis, Benjamin J. Puttnam, Georg Rademacher, Satoshi Shinada, Tetsuya Hayashi, Tetsuya Nakanishi, Yuki Saito, Tetsu Morishima, and Hideaki Furukawa

European Conference and Exhibition on Optical Communication 2022

Basel Switzerland
18–22 September 2022
ISBN: 978-1-957171-15-9

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Intra-data Centre Networks (Th2D)

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R. S. Luis, B. J. Puttnam, G. Rademacher, S. Shinada, T. Hayashi, T. Nakanishi, Y. Saito, T. Morishima, and H. Furukawa, "128 Tb/s SDM Optical Interconnect for a Spine-Leaf Datacenter Network with Spatial Channel Connectivity," in European Conference on Optical Communication (ECOC) 2022, J. Leuthold, C. Harder, B. Offrein, and H. Limberger, eds., Technical Digest Series (Optica Publishing Group, 2022), paper Th2D.2.

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Abstract

We experimentally demonstrate 12.8 Tb/s optical-interconnects using an 8-core or two 4- core multicore fibers w ith 64×200 G b/s PAM-4 lanes implementing S DM s pine-leaf datacenter network topologies. We evaluate a conventional topology with 12.8 Tb/s interconnects and the use of low-loss optical cross-connects for spatial channel connectivity.

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