Author Affiliations

Jiachen Li,^2,4 Kechao Tang,^1,2,3 Kaichen Dong,^1,2 Madeleine P. Gordon,^4,5 Finnegan G. Reichertz,⁶ Hyungjin Kim,^2,7 Yoonsoo Rho,⁸ Qingjun Wang,^1,2 Chang-Yu Lin,¹ Costas P. Grigoropoulos,⁸ Ali Javey,^2,7 Jeffrey J. Urban,⁵ Jie Yao,^1,2 Ronnen Levinson,⁹ and Junqiao Wu^1,2,4,*

¹Department of Materials Science and Engineering, University of California, Berkeley, CA, 94720, USA.

²Division of Materials Sciences, Lawrence Berkeley National Laboratory, Berkeley, CA, 94720, USA.

³Key Laboratory of Microelectronic Devices and Circuits (MOE), School of Integrated Circuits, Peking University, Beijing 100871, P. R. China

⁴Applied Science and Technology Graduate Group, University of California, Berkeley, CA, 94720, USA

⁵The Molecular Foundry, Lawrence Berkeley National Laboratory, Berkeley, CA, 94720, USA

⁶East Bay Innovation Academy, 3800 Mountain Blvd., Oakland, CA, 94619, USA

⁷Department of Electrical Engineering and Computer Sciences, University of California, Berkeley, CA, 94720, USA.

⁸Department of Mechanical Engineering, University of California, Berkeley, CA, 94720, USA.

⁹Heat Island Group, Lawrence Berkeley National Laboratory, Berkeley, CA, 94720, USA.

^*Corresponding author: wuj@berkeley.edu