Abstract

In this talk, the recent achievements in the development and optimization of hybrid multi-layer CMOS-compatible material systems (e.g., SiN/Si, multi-layer Si/SiO₂, etc.) to address all the practical requirements of ultra-fast and ultra-compact integrated photonic structures will be discussed. Using these hybrid material systems, a series of ultra-compact and high-performance reconfigurable photonic devices and subsystems that are formed by using high Q resonators will be demonstrated. The use of these devices and subsystems for realization of densely-integrated reconfigurable photonic chips for signal processing and sensing applications will be discussed.

© 2016 Optical Society of America