Abstract

State-of-the-art photonic integration platforms based on indium phosphide (InP), silicon, or silicon nitride (SiN), offer nowadays commercial availability, which is a result of their significant development and constant evolution observed in recent years. Also, the number of market-ready products utilizing application-specific photonic integrated circuits (ASPICs) is constantly rising. So far, the main driver behind such dynamic progress were the telecom and datacom applications, e.g. multi-channel, high-speed transmitters and receivers based on the wavelength division multiplexing (WDM) technique [1]. However, simultaneously a clear trend of transition of laboratory-grade devices utilizing ASPICs into fully commercial solutions is observed in optical sensing.

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