First Demonstration of Silicon Wafer Inspection Capability using Visible to Short-Wave Infrared CAOS Camera

Nabeel A. Riza

doi:10.1364/AIO.2022.T1A.4

Applied Industrial Optics (AIO) 2022
Technical Digest Series (Optica Publishing Group, 2022),
paper T1A.4
•https://doi.org/10.1364/AIO.2022.T1A.4

First Demonstration of Silicon Wafer Inspection Capability using Visible to Short-Wave Infrared CAOS Camera

Nabeel A. Riza

Applied Industrial Optics: Spectroscopy, Imaging and Metrology 2022

Dublin Ireland
25–27 July 2022
ISBN: 978-1-957171-08-1

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Gettin’ the Spectrum Covered (T1A)

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N. A. Riza, "First Demonstration of Silicon Wafer Inspection Capability using Visible to Short-Wave Infrared CAOS Camera," in Applied Industrial Optics (AIO) 2022, A. Smith and G. Miller, eds., Technical Digest Series (Optica Publishing Group, 2022), paper T1A.4.

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Abstract

Highlighted is the multi-stack silicon wafer inspection capability of the visible to Short-Wave Infrared (SWIR) high linear dynamic range CAOS camera. SWIR experiments successfully image the location of the copper ring metallization between silicon wafers.

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