Co-Design and Co-Integration of Photonic and Electronic Circuitry: the H2020 WIPE approach

Xin Yin

doi:10.1364/ACPC.2017.Su3D.4

Asia Communications and Photonics Conference
OSA Technical Digest (online) (Optica Publishing Group, 2017),
paper Su3D.4
•https://doi.org/10.1364/ACPC.2017.Su3D.4

Co-Design and Co-Integration of Photonic and Electronic Circuitry: the H2020 WIPE approach

Xin Yin

Asia Communications and Photonics Conference 2017

Guangzhou, Guangdong China
10–13 November 2017
ISBN: 978-1-943580-34-7

From the session
Silicon Photonics I (Su3D)

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X. Yin, "Co-Design and Co-Integration of Photonic and Electronic Circuitry: the H2020 WIPE approach," in Asia Communications and Photonics Conference, OSA Technical Digest (online) (Optica Publishing Group, 2017), paper Su3D.4.

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Abstract

Effective co-design and co-integration of photonics and electronics allows for miniaturization and subsequently energy and cost savings. We describe the EU H2020 WIPE approach towards photonic/electronic integrated circuitry co-optimization and wafer-scale integration.

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