Expand this Topic clickable element to expand a topic
Skip to content
Optica Publishing Group

A Compact Multifiber Circuit Pack to Backplane Optical Connector

Not Accessible

Your library or personal account may give you access


This paper describes the design features and performance of a circuit pack to backplane multifiber optical connector capable of interconnecting up to 18 fibers through the backplane of an electronic hardware packaging system. Although designed for the AT&T FASTECH™1 system, it is compatible with other backplane type systems. The connector uses precision etched V-groove silicon chips to mass terminate the fibers. The fibers are epoxy bonded between two chips; this forms a rectangular assembly called an array. This proven epoxy bonded chip technology is used by AT&T for splicing both multimode and single mode ribbon fiber.

© 1986 Optical Society of America

PDF Article
More Like This
Optical fiber fanout connector for ten-fiber ribbon cable termination

WK2 Optical Fiber Communication Conference (OFC) 1986

Full-Mesh Optical Backplane with Modular Fiber Ribbon-based Sub-Circuits

Maddalena Ferrario, Domenico Coviello, Pierpaolo Boffi, Vito Basile, Irene Fassi, Matteo Falcucci, Chiara Renghini, and Mario Martinelli
Th2A.56 Optical Fiber Communication Conference (OFC) 2016

An Injection Molded Splice Connector With Silicon Chip Insert For Joining Optical Fiber Ribbons

Allen H. Cherin and Philip J. Rich
WA7 Optical Fiber Transmission (OFC) 1977

Select as filters

Select Topics Cancel
© Copyright 2024 | Optica Publishing Group. All rights reserved, including rights for text and data mining and training of artificial technologies or similar technologies.