Author Affiliations

Liang Li,^1,2,3,† Mei Cui,^2,3,4,† Hua Shao,⁴ Yijun Dai,^2,3 Li Chen,^2,3 Zi-hui Zhang,⁴ Jason Hoo,⁵ Shiping Guo,⁵ Wen’an Lan,⁶ Lili Cao,⁶ Hui Xu,¹ Wei Guo,^2,3,* and Jichun Ye^2,3,7

¹Laboratory for Microstructures, School of Materials Science and Engineering, Shanghai University, Shanghai 200444, China

²Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo, 315201 Zhejiang, China

³University of Chinese Academy of Sciences, Beijing 100049, China

⁴Hebei University of Technology, Institute of Micro-Nano Photoelectron and Electromagnetic Technology Innovation, School of Electronics and Information Engineering, Tianjin 300401, China

⁵Advanced Micro-Fabrication Equipment Inc., Shanghai 201201, China

⁶Zhe Jiang Bright Semiconductor Technology Co., Ltd., Jinhua, China

⁷e-mail: jichun.ye@nimte.ac.cn

^†These authors contributed equally to this Letter.

^*Corresponding author: guowei@nimte.ac.cn

ORCID

Zi-hui Zhang	https://orcid.org/0000-0003-0638-1118
Wei Guo	https://orcid.org/0000-0002-6233-0529