Abstract

We report on the heterogeneous integration of electrically pumped InP Fabry-Pérot lasers on a SOI photonic integrated circuit by transfer printing. Transfer printing is a promising micromanipulation technique that allows the heterogeneous integration of optical and electronic components realized on their native substrate onto a target substrate with efficient use of the source material, in a way that can be scaled to parallel manipulation and that allows mixing components from different sources onto the same target. We pre-process transfer printable etched facet Fabry-Pérot lasers on their native InP substrate, transfer print them into a trench defined in an SOI photonic chip and post-process the printed lasers on the target substrate. The laser facet is successfully butt-coupled to the photonic circuit using a silicon inverse taper based spot size converter. Milliwatt optical output power coupled to the Si waveguide circuit at 100 mA is demonstrated.

© 2018 Optical Society of America under the terms of the OSA Open Access Publishing Agreement

Full Article  |  PDF Article
OSA Recommended Articles
Transfer-printing-based integration of single-mode waveguide-coupled III-V-on-silicon broadband light emitters

Andreas De Groote, Paolo Cardile, Ananth Z. Subramanian, Alin M. Fecioru, Christopher Bower, Danae Delbeke, Roel Baets, and Günther Roelkens
Opt. Express 24(13) 13754-13762 (2016)

Transfer-printing-based integration of a III-V-on-silicon distributed feedback laser

Jing Zhang, Bahawal Haq, James O’Callaghan, Angieska Gocalinska, Emanuele Pelucchi, António José Trindade, Brian Corbett, Geert Morthier, and Gunther Roelkens
Opt. Express 26(7) 8821-8830 (2018)

High-alignment-accuracy transfer printing of passive silicon waveguide structures

Nan Ye, Grigorij Muliuk, Antonio Jose Trindade, Chris Bower, Jing Zhang, Sarah Uvin, Dries Van Thourhout, and Gunther Roelkens
Opt. Express 26(2) 2023-2032 (2018)

References

  • View by:
  • |
  • |
  • |

  1. G. Roelkens, L. Liu, D. Liang, R. Jones, A. W. Fang, B. Koch, and J. E. Bowers, “III–V/silicon photonics for on-chip and intra-chip optical interconnects,” Laser Photonics Rev. 4, 751–779 (2010).
    [Crossref]
  2. Z. Wang, A. Abbasi, U. Dave, A. De Groote, S. Kumari, B. Kunert, C. Merckling, M. Pantouvaki, Y. Shi, B. Tian, K. Van Gasse, J. Verbist, R. Wang, W. Xie, J. Zhang, Y. Zhu, J. Bauwelinck, X. Yin, Z. Hens, J. Van Campenhout, B. Kuyken, R. Baets, G. Morthier, D. Van Thourhout, and G. Roelkens, “Novel Light Source Integration Approaches for Silicon Photonics,” Laser Photonics Rev. 11, 1–21 (2017).
    [Crossref]
  3. T. Komljenovic, S. Srinivasan, E. Norberg, M. Davenport, G. Fish, and J. E. Bowers, “Widely Tunable Narrow-Linewidth Monolithically Integrated External-Cavity Semiconductor Lasers,” IEEE J. Sel. Top. Quantum Electron. 21, 1501909 (2015).
    [Crossref]
  4. Y. H. Jhang, K. Tanabe, S. Iwamoto, and Y. Arakawa, “InAs/GaAs quantum dot lasers on silicon-on-insulator substrates by metal-stripe wafer bonding,” IEEE Photonics Technol. Lett. 27, 875–878 (2015).
    [Crossref]
  5. S. Keyvaninia, M. Muneeb, S. Stanković, P. J. Van Veldhoven, D. Van Thourhout, and G. Roelkens, “Ultra-thin DVS-BCB adhesive bonding of III–V wafers, dies and multiple dies to a patterned silicon-on-insulator substrate,” Opt. Mater. Express 3, 35–46 (2013).
    [Crossref]
  6. B. Snyder, B. Corbett, and P. Obrien, “Hybrid integration of the wavelength-tunable laser with a silicon photonic integrated circuit,” J. Light. Technol. 31, 3934–3942 (2013).
    [Crossref]
  7. B. Tian, Z. Wang, M. Pantouvaki, P. Absil, J. Van Campenhout, C. Merckling, and D. Van Thourhout, “Room Temperature O-band DFB Laser Array Directly Grown on (001) Silicon,” Nano Lett. 17, 559–564 (2017).
    [Crossref]
  8. L. Megalini, B. Bonef, B. C. Cabinian, H. Zhao, A. Taylor, J. S. Speck, J. E. Bowers, and J. Klamkin, “1550-nm InGaAsP multi-quantum-well structures selectively grown on v-groove-patterned SOI substrates,” Appl. Phys. Lett. 111, 032105 (2017).
    [Crossref]
  9. B. Corbett, R. Loi, W. Zhou, D. Liu, and Z. Ma, “Transfer print techniques for heterogeneous integration of photonic components,” Prog. Quantum Electron. 52, 1–17 (2017).
    [Crossref]
  10. H. Yang, D. Zhao, S. Chuwongin, J. H. Seo, W. Yang, Y. Shuai, J. Berggren, M. Hammar, Z. Ma, and W. Zhou, “Transfer-printed stacked nanomembrane lasers on silicon,” Nat. Photonics 6, 615–620 (2012).
    [Crossref]
  11. A. De Groote, P. Cardile, A. Z. Subramanian, A. M. Fecioru, C. A. Bower, D. Delbeke, R. Baets, and G. Roelkens, “Transfer-printing-based integration of single-mode waveguide-coupled III–V-on-silicon broadband light emitters,” Opt. Express 24, 13754–13762 (2016).
    [Crossref] [PubMed]
  12. J. Zhang, B. Haq, J. O’Callaghan, A. Gocalinska, E. Pelucchi, A. J. Trindade, B. Corbett, G. Morthier, and G. Roelkens, “Transfer-printing-based integration of a III–V-on-silicon distributed feedback laser,” Opt. Express 26, 8821 (2018).
    [Crossref] [PubMed]
  13. M. a. Meitl, Z.-T. Zhu, V. Kumar, K. J. Lee, X. Feng, Y. Y. Huang, I. Adesida, R. G. Nuzzo, and J. a. Rogers, “Transfer printing by kinetic control of adhesion to an elastomeric stamp,” Nat. Mater. 5, 33–38 (2006).
    [Crossref]
  14. N. Hatori, T. Shimizu, M. Okano, M. Ishizaka, T. Yamamoto, Y. Urino, M. Mori, T. Nakamura, and Y. Arakawa, “A hybrid integrated light source on a silicon platform using a trident spot-size converter,” J. Light. Technol. 32, 1329–1336 (2014).
    [Crossref]
  15. C. Bower, D. Gomez, K. Lucht, B. Cox, and D. Kneeburg, “Transfer-printed integrated circuits for display back-planes,” in Proceedings of International Display Workshop, (2010), pp. 1203–1206.

2018 (1)

2017 (4)

Z. Wang, A. Abbasi, U. Dave, A. De Groote, S. Kumari, B. Kunert, C. Merckling, M. Pantouvaki, Y. Shi, B. Tian, K. Van Gasse, J. Verbist, R. Wang, W. Xie, J. Zhang, Y. Zhu, J. Bauwelinck, X. Yin, Z. Hens, J. Van Campenhout, B. Kuyken, R. Baets, G. Morthier, D. Van Thourhout, and G. Roelkens, “Novel Light Source Integration Approaches for Silicon Photonics,” Laser Photonics Rev. 11, 1–21 (2017).
[Crossref]

B. Tian, Z. Wang, M. Pantouvaki, P. Absil, J. Van Campenhout, C. Merckling, and D. Van Thourhout, “Room Temperature O-band DFB Laser Array Directly Grown on (001) Silicon,” Nano Lett. 17, 559–564 (2017).
[Crossref]

L. Megalini, B. Bonef, B. C. Cabinian, H. Zhao, A. Taylor, J. S. Speck, J. E. Bowers, and J. Klamkin, “1550-nm InGaAsP multi-quantum-well structures selectively grown on v-groove-patterned SOI substrates,” Appl. Phys. Lett. 111, 032105 (2017).
[Crossref]

B. Corbett, R. Loi, W. Zhou, D. Liu, and Z. Ma, “Transfer print techniques for heterogeneous integration of photonic components,” Prog. Quantum Electron. 52, 1–17 (2017).
[Crossref]

2016 (1)

2015 (2)

T. Komljenovic, S. Srinivasan, E. Norberg, M. Davenport, G. Fish, and J. E. Bowers, “Widely Tunable Narrow-Linewidth Monolithically Integrated External-Cavity Semiconductor Lasers,” IEEE J. Sel. Top. Quantum Electron. 21, 1501909 (2015).
[Crossref]

Y. H. Jhang, K. Tanabe, S. Iwamoto, and Y. Arakawa, “InAs/GaAs quantum dot lasers on silicon-on-insulator substrates by metal-stripe wafer bonding,” IEEE Photonics Technol. Lett. 27, 875–878 (2015).
[Crossref]

2014 (1)

N. Hatori, T. Shimizu, M. Okano, M. Ishizaka, T. Yamamoto, Y. Urino, M. Mori, T. Nakamura, and Y. Arakawa, “A hybrid integrated light source on a silicon platform using a trident spot-size converter,” J. Light. Technol. 32, 1329–1336 (2014).
[Crossref]

2013 (2)

2012 (1)

H. Yang, D. Zhao, S. Chuwongin, J. H. Seo, W. Yang, Y. Shuai, J. Berggren, M. Hammar, Z. Ma, and W. Zhou, “Transfer-printed stacked nanomembrane lasers on silicon,” Nat. Photonics 6, 615–620 (2012).
[Crossref]

2010 (1)

G. Roelkens, L. Liu, D. Liang, R. Jones, A. W. Fang, B. Koch, and J. E. Bowers, “III–V/silicon photonics for on-chip and intra-chip optical interconnects,” Laser Photonics Rev. 4, 751–779 (2010).
[Crossref]

2006 (1)

M. a. Meitl, Z.-T. Zhu, V. Kumar, K. J. Lee, X. Feng, Y. Y. Huang, I. Adesida, R. G. Nuzzo, and J. a. Rogers, “Transfer printing by kinetic control of adhesion to an elastomeric stamp,” Nat. Mater. 5, 33–38 (2006).
[Crossref]

Abbasi, A.

Z. Wang, A. Abbasi, U. Dave, A. De Groote, S. Kumari, B. Kunert, C. Merckling, M. Pantouvaki, Y. Shi, B. Tian, K. Van Gasse, J. Verbist, R. Wang, W. Xie, J. Zhang, Y. Zhu, J. Bauwelinck, X. Yin, Z. Hens, J. Van Campenhout, B. Kuyken, R. Baets, G. Morthier, D. Van Thourhout, and G. Roelkens, “Novel Light Source Integration Approaches for Silicon Photonics,” Laser Photonics Rev. 11, 1–21 (2017).
[Crossref]

Absil, P.

B. Tian, Z. Wang, M. Pantouvaki, P. Absil, J. Van Campenhout, C. Merckling, and D. Van Thourhout, “Room Temperature O-band DFB Laser Array Directly Grown on (001) Silicon,” Nano Lett. 17, 559–564 (2017).
[Crossref]

Adesida, I.

M. a. Meitl, Z.-T. Zhu, V. Kumar, K. J. Lee, X. Feng, Y. Y. Huang, I. Adesida, R. G. Nuzzo, and J. a. Rogers, “Transfer printing by kinetic control of adhesion to an elastomeric stamp,” Nat. Mater. 5, 33–38 (2006).
[Crossref]

Arakawa, Y.

Y. H. Jhang, K. Tanabe, S. Iwamoto, and Y. Arakawa, “InAs/GaAs quantum dot lasers on silicon-on-insulator substrates by metal-stripe wafer bonding,” IEEE Photonics Technol. Lett. 27, 875–878 (2015).
[Crossref]

N. Hatori, T. Shimizu, M. Okano, M. Ishizaka, T. Yamamoto, Y. Urino, M. Mori, T. Nakamura, and Y. Arakawa, “A hybrid integrated light source on a silicon platform using a trident spot-size converter,” J. Light. Technol. 32, 1329–1336 (2014).
[Crossref]

Baets, R.

Z. Wang, A. Abbasi, U. Dave, A. De Groote, S. Kumari, B. Kunert, C. Merckling, M. Pantouvaki, Y. Shi, B. Tian, K. Van Gasse, J. Verbist, R. Wang, W. Xie, J. Zhang, Y. Zhu, J. Bauwelinck, X. Yin, Z. Hens, J. Van Campenhout, B. Kuyken, R. Baets, G. Morthier, D. Van Thourhout, and G. Roelkens, “Novel Light Source Integration Approaches for Silicon Photonics,” Laser Photonics Rev. 11, 1–21 (2017).
[Crossref]

A. De Groote, P. Cardile, A. Z. Subramanian, A. M. Fecioru, C. A. Bower, D. Delbeke, R. Baets, and G. Roelkens, “Transfer-printing-based integration of single-mode waveguide-coupled III–V-on-silicon broadband light emitters,” Opt. Express 24, 13754–13762 (2016).
[Crossref] [PubMed]

Bauwelinck, J.

Z. Wang, A. Abbasi, U. Dave, A. De Groote, S. Kumari, B. Kunert, C. Merckling, M. Pantouvaki, Y. Shi, B. Tian, K. Van Gasse, J. Verbist, R. Wang, W. Xie, J. Zhang, Y. Zhu, J. Bauwelinck, X. Yin, Z. Hens, J. Van Campenhout, B. Kuyken, R. Baets, G. Morthier, D. Van Thourhout, and G. Roelkens, “Novel Light Source Integration Approaches for Silicon Photonics,” Laser Photonics Rev. 11, 1–21 (2017).
[Crossref]

Berggren, J.

H. Yang, D. Zhao, S. Chuwongin, J. H. Seo, W. Yang, Y. Shuai, J. Berggren, M. Hammar, Z. Ma, and W. Zhou, “Transfer-printed stacked nanomembrane lasers on silicon,” Nat. Photonics 6, 615–620 (2012).
[Crossref]

Bonef, B.

L. Megalini, B. Bonef, B. C. Cabinian, H. Zhao, A. Taylor, J. S. Speck, J. E. Bowers, and J. Klamkin, “1550-nm InGaAsP multi-quantum-well structures selectively grown on v-groove-patterned SOI substrates,” Appl. Phys. Lett. 111, 032105 (2017).
[Crossref]

Bower, C.

C. Bower, D. Gomez, K. Lucht, B. Cox, and D. Kneeburg, “Transfer-printed integrated circuits for display back-planes,” in Proceedings of International Display Workshop, (2010), pp. 1203–1206.

Bower, C. A.

Bowers, J. E.

L. Megalini, B. Bonef, B. C. Cabinian, H. Zhao, A. Taylor, J. S. Speck, J. E. Bowers, and J. Klamkin, “1550-nm InGaAsP multi-quantum-well structures selectively grown on v-groove-patterned SOI substrates,” Appl. Phys. Lett. 111, 032105 (2017).
[Crossref]

T. Komljenovic, S. Srinivasan, E. Norberg, M. Davenport, G. Fish, and J. E. Bowers, “Widely Tunable Narrow-Linewidth Monolithically Integrated External-Cavity Semiconductor Lasers,” IEEE J. Sel. Top. Quantum Electron. 21, 1501909 (2015).
[Crossref]

G. Roelkens, L. Liu, D. Liang, R. Jones, A. W. Fang, B. Koch, and J. E. Bowers, “III–V/silicon photonics for on-chip and intra-chip optical interconnects,” Laser Photonics Rev. 4, 751–779 (2010).
[Crossref]

Cabinian, B. C.

L. Megalini, B. Bonef, B. C. Cabinian, H. Zhao, A. Taylor, J. S. Speck, J. E. Bowers, and J. Klamkin, “1550-nm InGaAsP multi-quantum-well structures selectively grown on v-groove-patterned SOI substrates,” Appl. Phys. Lett. 111, 032105 (2017).
[Crossref]

Cardile, P.

Chuwongin, S.

H. Yang, D. Zhao, S. Chuwongin, J. H. Seo, W. Yang, Y. Shuai, J. Berggren, M. Hammar, Z. Ma, and W. Zhou, “Transfer-printed stacked nanomembrane lasers on silicon,” Nat. Photonics 6, 615–620 (2012).
[Crossref]

Corbett, B.

J. Zhang, B. Haq, J. O’Callaghan, A. Gocalinska, E. Pelucchi, A. J. Trindade, B. Corbett, G. Morthier, and G. Roelkens, “Transfer-printing-based integration of a III–V-on-silicon distributed feedback laser,” Opt. Express 26, 8821 (2018).
[Crossref] [PubMed]

B. Corbett, R. Loi, W. Zhou, D. Liu, and Z. Ma, “Transfer print techniques for heterogeneous integration of photonic components,” Prog. Quantum Electron. 52, 1–17 (2017).
[Crossref]

B. Snyder, B. Corbett, and P. Obrien, “Hybrid integration of the wavelength-tunable laser with a silicon photonic integrated circuit,” J. Light. Technol. 31, 3934–3942 (2013).
[Crossref]

Cox, B.

C. Bower, D. Gomez, K. Lucht, B. Cox, and D. Kneeburg, “Transfer-printed integrated circuits for display back-planes,” in Proceedings of International Display Workshop, (2010), pp. 1203–1206.

Dave, U.

Z. Wang, A. Abbasi, U. Dave, A. De Groote, S. Kumari, B. Kunert, C. Merckling, M. Pantouvaki, Y. Shi, B. Tian, K. Van Gasse, J. Verbist, R. Wang, W. Xie, J. Zhang, Y. Zhu, J. Bauwelinck, X. Yin, Z. Hens, J. Van Campenhout, B. Kuyken, R. Baets, G. Morthier, D. Van Thourhout, and G. Roelkens, “Novel Light Source Integration Approaches for Silicon Photonics,” Laser Photonics Rev. 11, 1–21 (2017).
[Crossref]

Davenport, M.

T. Komljenovic, S. Srinivasan, E. Norberg, M. Davenport, G. Fish, and J. E. Bowers, “Widely Tunable Narrow-Linewidth Monolithically Integrated External-Cavity Semiconductor Lasers,” IEEE J. Sel. Top. Quantum Electron. 21, 1501909 (2015).
[Crossref]

De Groote, A.

Z. Wang, A. Abbasi, U. Dave, A. De Groote, S. Kumari, B. Kunert, C. Merckling, M. Pantouvaki, Y. Shi, B. Tian, K. Van Gasse, J. Verbist, R. Wang, W. Xie, J. Zhang, Y. Zhu, J. Bauwelinck, X. Yin, Z. Hens, J. Van Campenhout, B. Kuyken, R. Baets, G. Morthier, D. Van Thourhout, and G. Roelkens, “Novel Light Source Integration Approaches for Silicon Photonics,” Laser Photonics Rev. 11, 1–21 (2017).
[Crossref]

A. De Groote, P. Cardile, A. Z. Subramanian, A. M. Fecioru, C. A. Bower, D. Delbeke, R. Baets, and G. Roelkens, “Transfer-printing-based integration of single-mode waveguide-coupled III–V-on-silicon broadband light emitters,” Opt. Express 24, 13754–13762 (2016).
[Crossref] [PubMed]

Delbeke, D.

Fang, A. W.

G. Roelkens, L. Liu, D. Liang, R. Jones, A. W. Fang, B. Koch, and J. E. Bowers, “III–V/silicon photonics for on-chip and intra-chip optical interconnects,” Laser Photonics Rev. 4, 751–779 (2010).
[Crossref]

Fecioru, A. M.

Feng, X.

M. a. Meitl, Z.-T. Zhu, V. Kumar, K. J. Lee, X. Feng, Y. Y. Huang, I. Adesida, R. G. Nuzzo, and J. a. Rogers, “Transfer printing by kinetic control of adhesion to an elastomeric stamp,” Nat. Mater. 5, 33–38 (2006).
[Crossref]

Fish, G.

T. Komljenovic, S. Srinivasan, E. Norberg, M. Davenport, G. Fish, and J. E. Bowers, “Widely Tunable Narrow-Linewidth Monolithically Integrated External-Cavity Semiconductor Lasers,” IEEE J. Sel. Top. Quantum Electron. 21, 1501909 (2015).
[Crossref]

Gocalinska, A.

Gomez, D.

C. Bower, D. Gomez, K. Lucht, B. Cox, and D. Kneeburg, “Transfer-printed integrated circuits for display back-planes,” in Proceedings of International Display Workshop, (2010), pp. 1203–1206.

Hammar, M.

H. Yang, D. Zhao, S. Chuwongin, J. H. Seo, W. Yang, Y. Shuai, J. Berggren, M. Hammar, Z. Ma, and W. Zhou, “Transfer-printed stacked nanomembrane lasers on silicon,” Nat. Photonics 6, 615–620 (2012).
[Crossref]

Haq, B.

Hatori, N.

N. Hatori, T. Shimizu, M. Okano, M. Ishizaka, T. Yamamoto, Y. Urino, M. Mori, T. Nakamura, and Y. Arakawa, “A hybrid integrated light source on a silicon platform using a trident spot-size converter,” J. Light. Technol. 32, 1329–1336 (2014).
[Crossref]

Hens, Z.

Z. Wang, A. Abbasi, U. Dave, A. De Groote, S. Kumari, B. Kunert, C. Merckling, M. Pantouvaki, Y. Shi, B. Tian, K. Van Gasse, J. Verbist, R. Wang, W. Xie, J. Zhang, Y. Zhu, J. Bauwelinck, X. Yin, Z. Hens, J. Van Campenhout, B. Kuyken, R. Baets, G. Morthier, D. Van Thourhout, and G. Roelkens, “Novel Light Source Integration Approaches for Silicon Photonics,” Laser Photonics Rev. 11, 1–21 (2017).
[Crossref]

Huang, Y. Y.

M. a. Meitl, Z.-T. Zhu, V. Kumar, K. J. Lee, X. Feng, Y. Y. Huang, I. Adesida, R. G. Nuzzo, and J. a. Rogers, “Transfer printing by kinetic control of adhesion to an elastomeric stamp,” Nat. Mater. 5, 33–38 (2006).
[Crossref]

Ishizaka, M.

N. Hatori, T. Shimizu, M. Okano, M. Ishizaka, T. Yamamoto, Y. Urino, M. Mori, T. Nakamura, and Y. Arakawa, “A hybrid integrated light source on a silicon platform using a trident spot-size converter,” J. Light. Technol. 32, 1329–1336 (2014).
[Crossref]

Iwamoto, S.

Y. H. Jhang, K. Tanabe, S. Iwamoto, and Y. Arakawa, “InAs/GaAs quantum dot lasers on silicon-on-insulator substrates by metal-stripe wafer bonding,” IEEE Photonics Technol. Lett. 27, 875–878 (2015).
[Crossref]

Jhang, Y. H.

Y. H. Jhang, K. Tanabe, S. Iwamoto, and Y. Arakawa, “InAs/GaAs quantum dot lasers on silicon-on-insulator substrates by metal-stripe wafer bonding,” IEEE Photonics Technol. Lett. 27, 875–878 (2015).
[Crossref]

Jones, R.

G. Roelkens, L. Liu, D. Liang, R. Jones, A. W. Fang, B. Koch, and J. E. Bowers, “III–V/silicon photonics for on-chip and intra-chip optical interconnects,” Laser Photonics Rev. 4, 751–779 (2010).
[Crossref]

Keyvaninia, S.

Klamkin, J.

L. Megalini, B. Bonef, B. C. Cabinian, H. Zhao, A. Taylor, J. S. Speck, J. E. Bowers, and J. Klamkin, “1550-nm InGaAsP multi-quantum-well structures selectively grown on v-groove-patterned SOI substrates,” Appl. Phys. Lett. 111, 032105 (2017).
[Crossref]

Kneeburg, D.

C. Bower, D. Gomez, K. Lucht, B. Cox, and D. Kneeburg, “Transfer-printed integrated circuits for display back-planes,” in Proceedings of International Display Workshop, (2010), pp. 1203–1206.

Koch, B.

G. Roelkens, L. Liu, D. Liang, R. Jones, A. W. Fang, B. Koch, and J. E. Bowers, “III–V/silicon photonics for on-chip and intra-chip optical interconnects,” Laser Photonics Rev. 4, 751–779 (2010).
[Crossref]

Komljenovic, T.

T. Komljenovic, S. Srinivasan, E. Norberg, M. Davenport, G. Fish, and J. E. Bowers, “Widely Tunable Narrow-Linewidth Monolithically Integrated External-Cavity Semiconductor Lasers,” IEEE J. Sel. Top. Quantum Electron. 21, 1501909 (2015).
[Crossref]

Kumar, V.

M. a. Meitl, Z.-T. Zhu, V. Kumar, K. J. Lee, X. Feng, Y. Y. Huang, I. Adesida, R. G. Nuzzo, and J. a. Rogers, “Transfer printing by kinetic control of adhesion to an elastomeric stamp,” Nat. Mater. 5, 33–38 (2006).
[Crossref]

Kumari, S.

Z. Wang, A. Abbasi, U. Dave, A. De Groote, S. Kumari, B. Kunert, C. Merckling, M. Pantouvaki, Y. Shi, B. Tian, K. Van Gasse, J. Verbist, R. Wang, W. Xie, J. Zhang, Y. Zhu, J. Bauwelinck, X. Yin, Z. Hens, J. Van Campenhout, B. Kuyken, R. Baets, G. Morthier, D. Van Thourhout, and G. Roelkens, “Novel Light Source Integration Approaches for Silicon Photonics,” Laser Photonics Rev. 11, 1–21 (2017).
[Crossref]

Kunert, B.

Z. Wang, A. Abbasi, U. Dave, A. De Groote, S. Kumari, B. Kunert, C. Merckling, M. Pantouvaki, Y. Shi, B. Tian, K. Van Gasse, J. Verbist, R. Wang, W. Xie, J. Zhang, Y. Zhu, J. Bauwelinck, X. Yin, Z. Hens, J. Van Campenhout, B. Kuyken, R. Baets, G. Morthier, D. Van Thourhout, and G. Roelkens, “Novel Light Source Integration Approaches for Silicon Photonics,” Laser Photonics Rev. 11, 1–21 (2017).
[Crossref]

Kuyken, B.

Z. Wang, A. Abbasi, U. Dave, A. De Groote, S. Kumari, B. Kunert, C. Merckling, M. Pantouvaki, Y. Shi, B. Tian, K. Van Gasse, J. Verbist, R. Wang, W. Xie, J. Zhang, Y. Zhu, J. Bauwelinck, X. Yin, Z. Hens, J. Van Campenhout, B. Kuyken, R. Baets, G. Morthier, D. Van Thourhout, and G. Roelkens, “Novel Light Source Integration Approaches for Silicon Photonics,” Laser Photonics Rev. 11, 1–21 (2017).
[Crossref]

Lee, K. J.

M. a. Meitl, Z.-T. Zhu, V. Kumar, K. J. Lee, X. Feng, Y. Y. Huang, I. Adesida, R. G. Nuzzo, and J. a. Rogers, “Transfer printing by kinetic control of adhesion to an elastomeric stamp,” Nat. Mater. 5, 33–38 (2006).
[Crossref]

Liang, D.

G. Roelkens, L. Liu, D. Liang, R. Jones, A. W. Fang, B. Koch, and J. E. Bowers, “III–V/silicon photonics for on-chip and intra-chip optical interconnects,” Laser Photonics Rev. 4, 751–779 (2010).
[Crossref]

Liu, D.

B. Corbett, R. Loi, W. Zhou, D. Liu, and Z. Ma, “Transfer print techniques for heterogeneous integration of photonic components,” Prog. Quantum Electron. 52, 1–17 (2017).
[Crossref]

Liu, L.

G. Roelkens, L. Liu, D. Liang, R. Jones, A. W. Fang, B. Koch, and J. E. Bowers, “III–V/silicon photonics for on-chip and intra-chip optical interconnects,” Laser Photonics Rev. 4, 751–779 (2010).
[Crossref]

Loi, R.

B. Corbett, R. Loi, W. Zhou, D. Liu, and Z. Ma, “Transfer print techniques for heterogeneous integration of photonic components,” Prog. Quantum Electron. 52, 1–17 (2017).
[Crossref]

Lucht, K.

C. Bower, D. Gomez, K. Lucht, B. Cox, and D. Kneeburg, “Transfer-printed integrated circuits for display back-planes,” in Proceedings of International Display Workshop, (2010), pp. 1203–1206.

Ma, Z.

B. Corbett, R. Loi, W. Zhou, D. Liu, and Z. Ma, “Transfer print techniques for heterogeneous integration of photonic components,” Prog. Quantum Electron. 52, 1–17 (2017).
[Crossref]

H. Yang, D. Zhao, S. Chuwongin, J. H. Seo, W. Yang, Y. Shuai, J. Berggren, M. Hammar, Z. Ma, and W. Zhou, “Transfer-printed stacked nanomembrane lasers on silicon,” Nat. Photonics 6, 615–620 (2012).
[Crossref]

Megalini, L.

L. Megalini, B. Bonef, B. C. Cabinian, H. Zhao, A. Taylor, J. S. Speck, J. E. Bowers, and J. Klamkin, “1550-nm InGaAsP multi-quantum-well structures selectively grown on v-groove-patterned SOI substrates,” Appl. Phys. Lett. 111, 032105 (2017).
[Crossref]

Meitl, M. a.

M. a. Meitl, Z.-T. Zhu, V. Kumar, K. J. Lee, X. Feng, Y. Y. Huang, I. Adesida, R. G. Nuzzo, and J. a. Rogers, “Transfer printing by kinetic control of adhesion to an elastomeric stamp,” Nat. Mater. 5, 33–38 (2006).
[Crossref]

Merckling, C.

B. Tian, Z. Wang, M. Pantouvaki, P. Absil, J. Van Campenhout, C. Merckling, and D. Van Thourhout, “Room Temperature O-band DFB Laser Array Directly Grown on (001) Silicon,” Nano Lett. 17, 559–564 (2017).
[Crossref]

Z. Wang, A. Abbasi, U. Dave, A. De Groote, S. Kumari, B. Kunert, C. Merckling, M. Pantouvaki, Y. Shi, B. Tian, K. Van Gasse, J. Verbist, R. Wang, W. Xie, J. Zhang, Y. Zhu, J. Bauwelinck, X. Yin, Z. Hens, J. Van Campenhout, B. Kuyken, R. Baets, G. Morthier, D. Van Thourhout, and G. Roelkens, “Novel Light Source Integration Approaches for Silicon Photonics,” Laser Photonics Rev. 11, 1–21 (2017).
[Crossref]

Mori, M.

N. Hatori, T. Shimizu, M. Okano, M. Ishizaka, T. Yamamoto, Y. Urino, M. Mori, T. Nakamura, and Y. Arakawa, “A hybrid integrated light source on a silicon platform using a trident spot-size converter,” J. Light. Technol. 32, 1329–1336 (2014).
[Crossref]

Morthier, G.

J. Zhang, B. Haq, J. O’Callaghan, A. Gocalinska, E. Pelucchi, A. J. Trindade, B. Corbett, G. Morthier, and G. Roelkens, “Transfer-printing-based integration of a III–V-on-silicon distributed feedback laser,” Opt. Express 26, 8821 (2018).
[Crossref] [PubMed]

Z. Wang, A. Abbasi, U. Dave, A. De Groote, S. Kumari, B. Kunert, C. Merckling, M. Pantouvaki, Y. Shi, B. Tian, K. Van Gasse, J. Verbist, R. Wang, W. Xie, J. Zhang, Y. Zhu, J. Bauwelinck, X. Yin, Z. Hens, J. Van Campenhout, B. Kuyken, R. Baets, G. Morthier, D. Van Thourhout, and G. Roelkens, “Novel Light Source Integration Approaches for Silicon Photonics,” Laser Photonics Rev. 11, 1–21 (2017).
[Crossref]

Muneeb, M.

Nakamura, T.

N. Hatori, T. Shimizu, M. Okano, M. Ishizaka, T. Yamamoto, Y. Urino, M. Mori, T. Nakamura, and Y. Arakawa, “A hybrid integrated light source on a silicon platform using a trident spot-size converter,” J. Light. Technol. 32, 1329–1336 (2014).
[Crossref]

Norberg, E.

T. Komljenovic, S. Srinivasan, E. Norberg, M. Davenport, G. Fish, and J. E. Bowers, “Widely Tunable Narrow-Linewidth Monolithically Integrated External-Cavity Semiconductor Lasers,” IEEE J. Sel. Top. Quantum Electron. 21, 1501909 (2015).
[Crossref]

Nuzzo, R. G.

M. a. Meitl, Z.-T. Zhu, V. Kumar, K. J. Lee, X. Feng, Y. Y. Huang, I. Adesida, R. G. Nuzzo, and J. a. Rogers, “Transfer printing by kinetic control of adhesion to an elastomeric stamp,” Nat. Mater. 5, 33–38 (2006).
[Crossref]

O’Callaghan, J.

Obrien, P.

B. Snyder, B. Corbett, and P. Obrien, “Hybrid integration of the wavelength-tunable laser with a silicon photonic integrated circuit,” J. Light. Technol. 31, 3934–3942 (2013).
[Crossref]

Okano, M.

N. Hatori, T. Shimizu, M. Okano, M. Ishizaka, T. Yamamoto, Y. Urino, M. Mori, T. Nakamura, and Y. Arakawa, “A hybrid integrated light source on a silicon platform using a trident spot-size converter,” J. Light. Technol. 32, 1329–1336 (2014).
[Crossref]

Pantouvaki, M.

B. Tian, Z. Wang, M. Pantouvaki, P. Absil, J. Van Campenhout, C. Merckling, and D. Van Thourhout, “Room Temperature O-band DFB Laser Array Directly Grown on (001) Silicon,” Nano Lett. 17, 559–564 (2017).
[Crossref]

Z. Wang, A. Abbasi, U. Dave, A. De Groote, S. Kumari, B. Kunert, C. Merckling, M. Pantouvaki, Y. Shi, B. Tian, K. Van Gasse, J. Verbist, R. Wang, W. Xie, J. Zhang, Y. Zhu, J. Bauwelinck, X. Yin, Z. Hens, J. Van Campenhout, B. Kuyken, R. Baets, G. Morthier, D. Van Thourhout, and G. Roelkens, “Novel Light Source Integration Approaches for Silicon Photonics,” Laser Photonics Rev. 11, 1–21 (2017).
[Crossref]

Pelucchi, E.

Roelkens, G.

J. Zhang, B. Haq, J. O’Callaghan, A. Gocalinska, E. Pelucchi, A. J. Trindade, B. Corbett, G. Morthier, and G. Roelkens, “Transfer-printing-based integration of a III–V-on-silicon distributed feedback laser,” Opt. Express 26, 8821 (2018).
[Crossref] [PubMed]

Z. Wang, A. Abbasi, U. Dave, A. De Groote, S. Kumari, B. Kunert, C. Merckling, M. Pantouvaki, Y. Shi, B. Tian, K. Van Gasse, J. Verbist, R. Wang, W. Xie, J. Zhang, Y. Zhu, J. Bauwelinck, X. Yin, Z. Hens, J. Van Campenhout, B. Kuyken, R. Baets, G. Morthier, D. Van Thourhout, and G. Roelkens, “Novel Light Source Integration Approaches for Silicon Photonics,” Laser Photonics Rev. 11, 1–21 (2017).
[Crossref]

A. De Groote, P. Cardile, A. Z. Subramanian, A. M. Fecioru, C. A. Bower, D. Delbeke, R. Baets, and G. Roelkens, “Transfer-printing-based integration of single-mode waveguide-coupled III–V-on-silicon broadband light emitters,” Opt. Express 24, 13754–13762 (2016).
[Crossref] [PubMed]

S. Keyvaninia, M. Muneeb, S. Stanković, P. J. Van Veldhoven, D. Van Thourhout, and G. Roelkens, “Ultra-thin DVS-BCB adhesive bonding of III–V wafers, dies and multiple dies to a patterned silicon-on-insulator substrate,” Opt. Mater. Express 3, 35–46 (2013).
[Crossref]

G. Roelkens, L. Liu, D. Liang, R. Jones, A. W. Fang, B. Koch, and J. E. Bowers, “III–V/silicon photonics for on-chip and intra-chip optical interconnects,” Laser Photonics Rev. 4, 751–779 (2010).
[Crossref]

Rogers, J. a.

M. a. Meitl, Z.-T. Zhu, V. Kumar, K. J. Lee, X. Feng, Y. Y. Huang, I. Adesida, R. G. Nuzzo, and J. a. Rogers, “Transfer printing by kinetic control of adhesion to an elastomeric stamp,” Nat. Mater. 5, 33–38 (2006).
[Crossref]

Seo, J. H.

H. Yang, D. Zhao, S. Chuwongin, J. H. Seo, W. Yang, Y. Shuai, J. Berggren, M. Hammar, Z. Ma, and W. Zhou, “Transfer-printed stacked nanomembrane lasers on silicon,” Nat. Photonics 6, 615–620 (2012).
[Crossref]

Shi, Y.

Z. Wang, A. Abbasi, U. Dave, A. De Groote, S. Kumari, B. Kunert, C. Merckling, M. Pantouvaki, Y. Shi, B. Tian, K. Van Gasse, J. Verbist, R. Wang, W. Xie, J. Zhang, Y. Zhu, J. Bauwelinck, X. Yin, Z. Hens, J. Van Campenhout, B. Kuyken, R. Baets, G. Morthier, D. Van Thourhout, and G. Roelkens, “Novel Light Source Integration Approaches for Silicon Photonics,” Laser Photonics Rev. 11, 1–21 (2017).
[Crossref]

Shimizu, T.

N. Hatori, T. Shimizu, M. Okano, M. Ishizaka, T. Yamamoto, Y. Urino, M. Mori, T. Nakamura, and Y. Arakawa, “A hybrid integrated light source on a silicon platform using a trident spot-size converter,” J. Light. Technol. 32, 1329–1336 (2014).
[Crossref]

Shuai, Y.

H. Yang, D. Zhao, S. Chuwongin, J. H. Seo, W. Yang, Y. Shuai, J. Berggren, M. Hammar, Z. Ma, and W. Zhou, “Transfer-printed stacked nanomembrane lasers on silicon,” Nat. Photonics 6, 615–620 (2012).
[Crossref]

Snyder, B.

B. Snyder, B. Corbett, and P. Obrien, “Hybrid integration of the wavelength-tunable laser with a silicon photonic integrated circuit,” J. Light. Technol. 31, 3934–3942 (2013).
[Crossref]

Speck, J. S.

L. Megalini, B. Bonef, B. C. Cabinian, H. Zhao, A. Taylor, J. S. Speck, J. E. Bowers, and J. Klamkin, “1550-nm InGaAsP multi-quantum-well structures selectively grown on v-groove-patterned SOI substrates,” Appl. Phys. Lett. 111, 032105 (2017).
[Crossref]

Srinivasan, S.

T. Komljenovic, S. Srinivasan, E. Norberg, M. Davenport, G. Fish, and J. E. Bowers, “Widely Tunable Narrow-Linewidth Monolithically Integrated External-Cavity Semiconductor Lasers,” IEEE J. Sel. Top. Quantum Electron. 21, 1501909 (2015).
[Crossref]

Stankovic, S.

Subramanian, A. Z.

Tanabe, K.

Y. H. Jhang, K. Tanabe, S. Iwamoto, and Y. Arakawa, “InAs/GaAs quantum dot lasers on silicon-on-insulator substrates by metal-stripe wafer bonding,” IEEE Photonics Technol. Lett. 27, 875–878 (2015).
[Crossref]

Taylor, A.

L. Megalini, B. Bonef, B. C. Cabinian, H. Zhao, A. Taylor, J. S. Speck, J. E. Bowers, and J. Klamkin, “1550-nm InGaAsP multi-quantum-well structures selectively grown on v-groove-patterned SOI substrates,” Appl. Phys. Lett. 111, 032105 (2017).
[Crossref]

Tian, B.

B. Tian, Z. Wang, M. Pantouvaki, P. Absil, J. Van Campenhout, C. Merckling, and D. Van Thourhout, “Room Temperature O-band DFB Laser Array Directly Grown on (001) Silicon,” Nano Lett. 17, 559–564 (2017).
[Crossref]

Z. Wang, A. Abbasi, U. Dave, A. De Groote, S. Kumari, B. Kunert, C. Merckling, M. Pantouvaki, Y. Shi, B. Tian, K. Van Gasse, J. Verbist, R. Wang, W. Xie, J. Zhang, Y. Zhu, J. Bauwelinck, X. Yin, Z. Hens, J. Van Campenhout, B. Kuyken, R. Baets, G. Morthier, D. Van Thourhout, and G. Roelkens, “Novel Light Source Integration Approaches for Silicon Photonics,” Laser Photonics Rev. 11, 1–21 (2017).
[Crossref]

Trindade, A. J.

Urino, Y.

N. Hatori, T. Shimizu, M. Okano, M. Ishizaka, T. Yamamoto, Y. Urino, M. Mori, T. Nakamura, and Y. Arakawa, “A hybrid integrated light source on a silicon platform using a trident spot-size converter,” J. Light. Technol. 32, 1329–1336 (2014).
[Crossref]

Van Campenhout, J.

Z. Wang, A. Abbasi, U. Dave, A. De Groote, S. Kumari, B. Kunert, C. Merckling, M. Pantouvaki, Y. Shi, B. Tian, K. Van Gasse, J. Verbist, R. Wang, W. Xie, J. Zhang, Y. Zhu, J. Bauwelinck, X. Yin, Z. Hens, J. Van Campenhout, B. Kuyken, R. Baets, G. Morthier, D. Van Thourhout, and G. Roelkens, “Novel Light Source Integration Approaches for Silicon Photonics,” Laser Photonics Rev. 11, 1–21 (2017).
[Crossref]

B. Tian, Z. Wang, M. Pantouvaki, P. Absil, J. Van Campenhout, C. Merckling, and D. Van Thourhout, “Room Temperature O-band DFB Laser Array Directly Grown on (001) Silicon,” Nano Lett. 17, 559–564 (2017).
[Crossref]

Van Gasse, K.

Z. Wang, A. Abbasi, U. Dave, A. De Groote, S. Kumari, B. Kunert, C. Merckling, M. Pantouvaki, Y. Shi, B. Tian, K. Van Gasse, J. Verbist, R. Wang, W. Xie, J. Zhang, Y. Zhu, J. Bauwelinck, X. Yin, Z. Hens, J. Van Campenhout, B. Kuyken, R. Baets, G. Morthier, D. Van Thourhout, and G. Roelkens, “Novel Light Source Integration Approaches for Silicon Photonics,” Laser Photonics Rev. 11, 1–21 (2017).
[Crossref]

Van Thourhout, D.

Z. Wang, A. Abbasi, U. Dave, A. De Groote, S. Kumari, B. Kunert, C. Merckling, M. Pantouvaki, Y. Shi, B. Tian, K. Van Gasse, J. Verbist, R. Wang, W. Xie, J. Zhang, Y. Zhu, J. Bauwelinck, X. Yin, Z. Hens, J. Van Campenhout, B. Kuyken, R. Baets, G. Morthier, D. Van Thourhout, and G. Roelkens, “Novel Light Source Integration Approaches for Silicon Photonics,” Laser Photonics Rev. 11, 1–21 (2017).
[Crossref]

B. Tian, Z. Wang, M. Pantouvaki, P. Absil, J. Van Campenhout, C. Merckling, and D. Van Thourhout, “Room Temperature O-band DFB Laser Array Directly Grown on (001) Silicon,” Nano Lett. 17, 559–564 (2017).
[Crossref]

S. Keyvaninia, M. Muneeb, S. Stanković, P. J. Van Veldhoven, D. Van Thourhout, and G. Roelkens, “Ultra-thin DVS-BCB adhesive bonding of III–V wafers, dies and multiple dies to a patterned silicon-on-insulator substrate,” Opt. Mater. Express 3, 35–46 (2013).
[Crossref]

Van Veldhoven, P. J.

Verbist, J.

Z. Wang, A. Abbasi, U. Dave, A. De Groote, S. Kumari, B. Kunert, C. Merckling, M. Pantouvaki, Y. Shi, B. Tian, K. Van Gasse, J. Verbist, R. Wang, W. Xie, J. Zhang, Y. Zhu, J. Bauwelinck, X. Yin, Z. Hens, J. Van Campenhout, B. Kuyken, R. Baets, G. Morthier, D. Van Thourhout, and G. Roelkens, “Novel Light Source Integration Approaches for Silicon Photonics,” Laser Photonics Rev. 11, 1–21 (2017).
[Crossref]

Wang, R.

Z. Wang, A. Abbasi, U. Dave, A. De Groote, S. Kumari, B. Kunert, C. Merckling, M. Pantouvaki, Y. Shi, B. Tian, K. Van Gasse, J. Verbist, R. Wang, W. Xie, J. Zhang, Y. Zhu, J. Bauwelinck, X. Yin, Z. Hens, J. Van Campenhout, B. Kuyken, R. Baets, G. Morthier, D. Van Thourhout, and G. Roelkens, “Novel Light Source Integration Approaches for Silicon Photonics,” Laser Photonics Rev. 11, 1–21 (2017).
[Crossref]

Wang, Z.

Z. Wang, A. Abbasi, U. Dave, A. De Groote, S. Kumari, B. Kunert, C. Merckling, M. Pantouvaki, Y. Shi, B. Tian, K. Van Gasse, J. Verbist, R. Wang, W. Xie, J. Zhang, Y. Zhu, J. Bauwelinck, X. Yin, Z. Hens, J. Van Campenhout, B. Kuyken, R. Baets, G. Morthier, D. Van Thourhout, and G. Roelkens, “Novel Light Source Integration Approaches for Silicon Photonics,” Laser Photonics Rev. 11, 1–21 (2017).
[Crossref]

B. Tian, Z. Wang, M. Pantouvaki, P. Absil, J. Van Campenhout, C. Merckling, and D. Van Thourhout, “Room Temperature O-band DFB Laser Array Directly Grown on (001) Silicon,” Nano Lett. 17, 559–564 (2017).
[Crossref]

Xie, W.

Z. Wang, A. Abbasi, U. Dave, A. De Groote, S. Kumari, B. Kunert, C. Merckling, M. Pantouvaki, Y. Shi, B. Tian, K. Van Gasse, J. Verbist, R. Wang, W. Xie, J. Zhang, Y. Zhu, J. Bauwelinck, X. Yin, Z. Hens, J. Van Campenhout, B. Kuyken, R. Baets, G. Morthier, D. Van Thourhout, and G. Roelkens, “Novel Light Source Integration Approaches for Silicon Photonics,” Laser Photonics Rev. 11, 1–21 (2017).
[Crossref]

Yamamoto, T.

N. Hatori, T. Shimizu, M. Okano, M. Ishizaka, T. Yamamoto, Y. Urino, M. Mori, T. Nakamura, and Y. Arakawa, “A hybrid integrated light source on a silicon platform using a trident spot-size converter,” J. Light. Technol. 32, 1329–1336 (2014).
[Crossref]

Yang, H.

H. Yang, D. Zhao, S. Chuwongin, J. H. Seo, W. Yang, Y. Shuai, J. Berggren, M. Hammar, Z. Ma, and W. Zhou, “Transfer-printed stacked nanomembrane lasers on silicon,” Nat. Photonics 6, 615–620 (2012).
[Crossref]

Yang, W.

H. Yang, D. Zhao, S. Chuwongin, J. H. Seo, W. Yang, Y. Shuai, J. Berggren, M. Hammar, Z. Ma, and W. Zhou, “Transfer-printed stacked nanomembrane lasers on silicon,” Nat. Photonics 6, 615–620 (2012).
[Crossref]

Yin, X.

Z. Wang, A. Abbasi, U. Dave, A. De Groote, S. Kumari, B. Kunert, C. Merckling, M. Pantouvaki, Y. Shi, B. Tian, K. Van Gasse, J. Verbist, R. Wang, W. Xie, J. Zhang, Y. Zhu, J. Bauwelinck, X. Yin, Z. Hens, J. Van Campenhout, B. Kuyken, R. Baets, G. Morthier, D. Van Thourhout, and G. Roelkens, “Novel Light Source Integration Approaches for Silicon Photonics,” Laser Photonics Rev. 11, 1–21 (2017).
[Crossref]

Zhang, J.

J. Zhang, B. Haq, J. O’Callaghan, A. Gocalinska, E. Pelucchi, A. J. Trindade, B. Corbett, G. Morthier, and G. Roelkens, “Transfer-printing-based integration of a III–V-on-silicon distributed feedback laser,” Opt. Express 26, 8821 (2018).
[Crossref] [PubMed]

Z. Wang, A. Abbasi, U. Dave, A. De Groote, S. Kumari, B. Kunert, C. Merckling, M. Pantouvaki, Y. Shi, B. Tian, K. Van Gasse, J. Verbist, R. Wang, W. Xie, J. Zhang, Y. Zhu, J. Bauwelinck, X. Yin, Z. Hens, J. Van Campenhout, B. Kuyken, R. Baets, G. Morthier, D. Van Thourhout, and G. Roelkens, “Novel Light Source Integration Approaches for Silicon Photonics,” Laser Photonics Rev. 11, 1–21 (2017).
[Crossref]

Zhao, D.

H. Yang, D. Zhao, S. Chuwongin, J. H. Seo, W. Yang, Y. Shuai, J. Berggren, M. Hammar, Z. Ma, and W. Zhou, “Transfer-printed stacked nanomembrane lasers on silicon,” Nat. Photonics 6, 615–620 (2012).
[Crossref]

Zhao, H.

L. Megalini, B. Bonef, B. C. Cabinian, H. Zhao, A. Taylor, J. S. Speck, J. E. Bowers, and J. Klamkin, “1550-nm InGaAsP multi-quantum-well structures selectively grown on v-groove-patterned SOI substrates,” Appl. Phys. Lett. 111, 032105 (2017).
[Crossref]

Zhou, W.

B. Corbett, R. Loi, W. Zhou, D. Liu, and Z. Ma, “Transfer print techniques for heterogeneous integration of photonic components,” Prog. Quantum Electron. 52, 1–17 (2017).
[Crossref]

H. Yang, D. Zhao, S. Chuwongin, J. H. Seo, W. Yang, Y. Shuai, J. Berggren, M. Hammar, Z. Ma, and W. Zhou, “Transfer-printed stacked nanomembrane lasers on silicon,” Nat. Photonics 6, 615–620 (2012).
[Crossref]

Zhu, Y.

Z. Wang, A. Abbasi, U. Dave, A. De Groote, S. Kumari, B. Kunert, C. Merckling, M. Pantouvaki, Y. Shi, B. Tian, K. Van Gasse, J. Verbist, R. Wang, W. Xie, J. Zhang, Y. Zhu, J. Bauwelinck, X. Yin, Z. Hens, J. Van Campenhout, B. Kuyken, R. Baets, G. Morthier, D. Van Thourhout, and G. Roelkens, “Novel Light Source Integration Approaches for Silicon Photonics,” Laser Photonics Rev. 11, 1–21 (2017).
[Crossref]

Zhu, Z.-T.

M. a. Meitl, Z.-T. Zhu, V. Kumar, K. J. Lee, X. Feng, Y. Y. Huang, I. Adesida, R. G. Nuzzo, and J. a. Rogers, “Transfer printing by kinetic control of adhesion to an elastomeric stamp,” Nat. Mater. 5, 33–38 (2006).
[Crossref]

Appl. Phys. Lett. (1)

L. Megalini, B. Bonef, B. C. Cabinian, H. Zhao, A. Taylor, J. S. Speck, J. E. Bowers, and J. Klamkin, “1550-nm InGaAsP multi-quantum-well structures selectively grown on v-groove-patterned SOI substrates,” Appl. Phys. Lett. 111, 032105 (2017).
[Crossref]

IEEE J. Sel. Top. Quantum Electron. (1)

T. Komljenovic, S. Srinivasan, E. Norberg, M. Davenport, G. Fish, and J. E. Bowers, “Widely Tunable Narrow-Linewidth Monolithically Integrated External-Cavity Semiconductor Lasers,” IEEE J. Sel. Top. Quantum Electron. 21, 1501909 (2015).
[Crossref]

IEEE Photonics Technol. Lett. (1)

Y. H. Jhang, K. Tanabe, S. Iwamoto, and Y. Arakawa, “InAs/GaAs quantum dot lasers on silicon-on-insulator substrates by metal-stripe wafer bonding,” IEEE Photonics Technol. Lett. 27, 875–878 (2015).
[Crossref]

J. Light. Technol. (2)

B. Snyder, B. Corbett, and P. Obrien, “Hybrid integration of the wavelength-tunable laser with a silicon photonic integrated circuit,” J. Light. Technol. 31, 3934–3942 (2013).
[Crossref]

N. Hatori, T. Shimizu, M. Okano, M. Ishizaka, T. Yamamoto, Y. Urino, M. Mori, T. Nakamura, and Y. Arakawa, “A hybrid integrated light source on a silicon platform using a trident spot-size converter,” J. Light. Technol. 32, 1329–1336 (2014).
[Crossref]

Laser Photonics Rev. (2)

G. Roelkens, L. Liu, D. Liang, R. Jones, A. W. Fang, B. Koch, and J. E. Bowers, “III–V/silicon photonics for on-chip and intra-chip optical interconnects,” Laser Photonics Rev. 4, 751–779 (2010).
[Crossref]

Z. Wang, A. Abbasi, U. Dave, A. De Groote, S. Kumari, B. Kunert, C. Merckling, M. Pantouvaki, Y. Shi, B. Tian, K. Van Gasse, J. Verbist, R. Wang, W. Xie, J. Zhang, Y. Zhu, J. Bauwelinck, X. Yin, Z. Hens, J. Van Campenhout, B. Kuyken, R. Baets, G. Morthier, D. Van Thourhout, and G. Roelkens, “Novel Light Source Integration Approaches for Silicon Photonics,” Laser Photonics Rev. 11, 1–21 (2017).
[Crossref]

Nano Lett. (1)

B. Tian, Z. Wang, M. Pantouvaki, P. Absil, J. Van Campenhout, C. Merckling, and D. Van Thourhout, “Room Temperature O-band DFB Laser Array Directly Grown on (001) Silicon,” Nano Lett. 17, 559–564 (2017).
[Crossref]

Nat. Mater. (1)

M. a. Meitl, Z.-T. Zhu, V. Kumar, K. J. Lee, X. Feng, Y. Y. Huang, I. Adesida, R. G. Nuzzo, and J. a. Rogers, “Transfer printing by kinetic control of adhesion to an elastomeric stamp,” Nat. Mater. 5, 33–38 (2006).
[Crossref]

Nat. Photonics (1)

H. Yang, D. Zhao, S. Chuwongin, J. H. Seo, W. Yang, Y. Shuai, J. Berggren, M. Hammar, Z. Ma, and W. Zhou, “Transfer-printed stacked nanomembrane lasers on silicon,” Nat. Photonics 6, 615–620 (2012).
[Crossref]

Opt. Express (2)

Opt. Mater. Express (1)

Prog. Quantum Electron. (1)

B. Corbett, R. Loi, W. Zhou, D. Liu, and Z. Ma, “Transfer print techniques for heterogeneous integration of photonic components,” Prog. Quantum Electron. 52, 1–17 (2017).
[Crossref]

Other (1)

C. Bower, D. Gomez, K. Lucht, B. Cox, and D. Kneeburg, “Transfer-printed integrated circuits for display back-planes,” in Proceedings of International Display Workshop, (2010), pp. 1203–1206.

Cited By

OSA participates in Crossref's Cited-By Linking service. Citing articles from OSA journals and other participating publishers are listed here.

Alert me when this article is cited.


Figures (15)

Fig. 1
Fig. 1 Proposed integration strategy. The III–V coupons are transfer printed directly on the silicon substrate for better thermal dissipation. The laser output is directly coupled into a spot size converter on the SOI side.
Fig. 2
Fig. 2 Schematic representation of the trident SSC. t stands for the width of the tip and s for the distance between the centers of the two tips.
Fig. 3
Fig. 3 Coupons transfer printed in the BOX trench. The bowtie features are used for pattern recognition during transfer printing. The coupling structures can be seen immediately to the left of the coupons.
Fig. 4
Fig. 4 Process flow for the pre-processing of the III–V coupons on the native substrate.
Fig. 5
Fig. 5 Schematic of the epi layer stack.
Fig. 6
Fig. 6 Schematic illustration of the transfer printing process.
Fig. 7
Fig. 7 Process flow for the post-processing of the coupons on the SOI target after transfer printing.
Fig. 8
Fig. 8 Fully post-processed coupons on the photonic chip.
Fig. 9
Fig. 9 SEM image of a coupon printed on a dummy silicon substrate. The features patterned on the substrate are used to measure the misalignment of the printed laser with respect to the intended position.
Fig. 10
Fig. 10 Misalignment of the coupons with respect to the ideal position marked with a red x at (0, 0). The mean absolute lateral misalignment is 420 nm with a standard deviation of 400 nm. The mean longitudinal misalignment is 750 nm with a standard deviation of 130 nm.
Fig. 11
Fig. 11 FIB cross section of a printed coupon (left) and the SOI chip (right). The quantum wells have been highlighted for convenience.
Fig. 12
Fig. 12 Optical power of the lasers printed on the dummy silicon substrate without temperature control. The output of the lasers is measured directly by a free space detector.
Fig. 13
Fig. 13 Optical power in the silicon waveguide after coupling the laser output to the integrated circuit. The temperature of the substrate is kept at 20 °C.
Fig. 14
Fig. 14 LI curves measured at the grating coupler for a particular laser printed on the photonic chip. Each curve corresponds to a different temperature of the stage.
Fig. 15
Fig. 15 (Left) Spectra of different coupons printed on the photonic chip. The measurement is taken at the grating coupler on the SOI chip. The substrate temperature is kept at 20 °C. The legend shows the driving current for each laser. (Right) A detailed view of the area around the peak for one of the spectra.

Metrics