Abstract

A transfer printing (TP) method is presented for the micro-assembly of integrated photonic devices from suspended membrane components. Ultra thin membranes with thickness of 150nm are directly printed without the use of mechanical support and adhesion layers. By using a correlation alignment scheme vertical integration of single-mode silicon waveguides is achieved with an average placement accuracy of 100±70nm. Silicon (Si) μ-ring resonators are also fabricated and show controllable optical coupling by varying the lateral absolute position to an underlying Si bus waveguide.

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    [Crossref]
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    [Crossref] [PubMed]
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    [Crossref]
  24. J. Wu, S. Kim, W. Chen, A. Carlson, K.-C. Hwang, Y. Huang, and J. A. Rogers, “Mechanics of reversible adhesion,” Soft Matter 7, 8657 (2011).
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    [Crossref]
  27. E. Anderson, “Sub-pixel alignment for direct-write electron beam lithography,” Microelectron. Eng. 73–74, 74–79 (2004).
    [Crossref]
  28. A. Broers, A. Hoole, and J. Ryan, “Electron beam lithography—resolution limits,” Microelectron. Eng. 32, 131–142 (1996).
    [Crossref]
  29. P. L. Stiles, “Direct deposition of micro- and nanoscale hydrogels using Dip Pen Nanolithography (DPN),” Nat. Method 7, i–ii (2010).
    [Crossref]
  30. W. Bogaerts, P. de Heyn, T. van Vaerenbergh, K. de Vos, S. Kumar Selvaraja, T. Claes, P. Dumon, P. Bienstman, D. van Thourhout, and R. Baets, “Silicon microring resonators,” Laser Photonics Rev. 6, 47–73 (2012).
    [Crossref]

2018 (2)

N. Ye, G. Muliuk, J. Zhang, A. Abbasi, A. J. Trindade, C. Bower, D. V. Thourhout, and G. Roelkens, “Transfer print integration of waveguide-coupled germanium photodiodes onto passive silicon photonic ICs,” J. Light. Technol. 36, 1249–1254 (2018).
[Crossref]

N. Ye, G. Muliuk, A. J. Trindade, C. Bower, J. Zhang, S. Uvin, D. V. Thourhout, and G. Roelkens, “High-alignment-accuracy transfer printing of passive silicon waveguide structures,” Opt. Express 26, 2023 (2018).
[Crossref] [PubMed]

2017 (7)

N. Volet, A. Spott, E. J. Stanton, M. L. Davenport, L. Chang, J. D. Peters, T. C. Briles, I. Vurgaftman, J. R. Meyer, and J. E. Bowers, “Semiconductor optical amplifiers at 2.0-μm wavelength on silicon,” Laser & Photonics Rev. 11, 1600165 (2017).
[Crossref]

R. Wang, A. Vasiliev, M. Muneeb, A. Malik, S. Sprengel, G. Boehm, M.-C. Amann, I. Šimonytė, A. Vizbaras, K. Vizbaras, R. Baets, and G. Roelkens, “III–V-on-Silicon Photonic Integrated Circuits for Spectroscopic Sensing in the 2–4 μm Wavelength Range,” Sensors. 17, 1788 (2017).
[Crossref]

T. Ahmed, T. Lu, T. Butler, J. Kulick, G. Bernstein, A. Hoffman, D. Hall, and S. Howard, “Mid-Infrared Waveguide Array Inter-chip Coupling using Optical Quilt Packaging,” IEEE Photonics Technol. Lett. 1135, 1 (2017).

G. Crosnier, D. Sanchez, S. Bouchoule, P. Monnier, G. Beaudoin, I. Sagnes, R. Raj, and F. Raineri, “Hybrid indium phosphide-on-silicon nanolaser diode,” Nat. Photonics 11, 297–300 (2017).
[Crossref]

J. Zhang, A. D. Groote, A. Abbasi, R. Loi, J. O’Callaghan, B. Corbett, A. J. Trindade, C. A. Bower, and G. Roelkens, “Silicon photonics fiber-to-the-home transceiver array based on transfer-printing-based integration of III–V photodetectors,” Opt. Express 25, 14290 (2017).
[Crossref] [PubMed]

C. Prevatte, E. Radauscher, M. A. Meitl, D. Gomez, K. Ghosal, S. Bonafede, B. Raymond, T. Moore, A. J. Trindade, P. Hines, and C. A. Bower, “Miniature Heterogeneous Fan-Out Packages for High-Performance, Large-Format Systems,” IEEE 5, A23–A29 (2017).

D. Jevtics, A. Hurtado, B. Guilhabert, J. McPhillimy, G. Cantarella, Q. Gao, H. H. Tan, C. Jagadish, M. J. Strain, and M. D. Dawson, “Integration of semiconductor nanowire lasers with polymeric waveguide devices on a mechanically flexible substrate,” Nano Lett. 17, 5990–5994 (2017).
[Crossref] [PubMed]

2016 (4)

S. Lin, X. Zheng, J. Yao, S. S. Djordjevic, J. E. Cunningham, J.-H. Lee, I. Shubin, Y. Luo, J. Bovington, D. Y. Lee, H. D. Thacker, K. Raj, and A. V. Krishnamoorthy, “Efficient, tunable flip-chip-integrated III–V/Si hybrid external-cavity laser array,” Opt. Express 24, 21454 (2016).
[Crossref] [PubMed]

K. Chen, Q. Huang, J. Zhang, J. Cheng, X. Fu, C. Zhang, K. Ma, Y. Shi, D. V. Thourhout, G. Roelkens, L. Liu, and S. He, “Wavelength-multiplexed duplex transceiver based on III–v/si hybrid integration for off-chip and on-chip optical interconnects,” IEEE Photonics J. 8, 1–10 (2016).

D. Liang, X. Huang, G. Kurczveil, M. Fiorentino, and R. G. Beausoleil, “Integrated finely tunable microring laser on silicon,” Nat. Photonics 10, 719–722 (2016).
[Crossref]

A. De Groote, P. Cardile, A. Z. Subramanian, A. M. Fecioru, C. Bower, D. Delbeke, R. Baets, and G. Roelkens, “Transfer-printing-based integration of single-mode waveguide-coupled III–V-on-silicon broadband light emitters,” Opt. Express 24, 13754 (2016).
[Crossref] [PubMed]

2015 (3)

J. Yoon, S. M. Lee, D. Kang, M. A. Meitl, C. A. Bower, and J. A. Rogers, “Heterogeneously Integrated Optoelectronic Devices Enabled by Micro-Transfer Printing,” Adv. Opt. Mater. 3, 1313–1335 (2015).
[Crossref]

G. Roelkens, A. Abassi, P. Cardile, U. Dave, A. de Groote, Y. de Koninck, S. Dhoore, X. Fu, A. Gassenq, N. Hattasan, Q. Huang, S. Kumari, S. Keyvaninia, B. Kuyken, L. Li, P. Mechet, M. Muneeb, D. Sanchez, H. Shao, T. Spuesens, A. Subramanian, S. Uvin, M. Tassaert, K. van Gasse, J. Verbist, R. Wang, Z. Wang, J. Zhang, J. van Campenhout, X. Yin, J. Bauwelinck, G. Morthier, R. Baets, and D. van Thourhout, “III–V-on-Silicon Photonic Devices for Optical Communication and Sensing,” Photonics. 2, 969–1004 (2015).
[Crossref]

A. J. Trindade, B. Guilhabert, E. Y. Xie, R. Ferreira, J. J. D. McKendry, D. Zhu, N. Laurand, E. Gu, D. J. Wallis, I. M. Watson, C. J. Humphreys, and M. D. Dawson, “Heterogeneous integration of gallium nitride light-emitting diodes on diamond and silica by transfer printing,” Opt. Express 23, 9329–9338 (2015).
[Crossref] [PubMed]

2013 (1)

M. J. R. Heck, J. F. Bauters, M. L. Davenport, J. K. Doylend, S. Jain, G. Kurczveil, S. Srinivasan, and J. E. Bowers, “Hybrid Silicon Photonic Integrated Circuit Technology,” IEEE J. Sel. Top. Quantum Electron. 19, 6100117 (2013).
[Crossref]

2012 (2)

J. Doylend and A. Knights, “The evolution of silicon photonics as an enabling technology for optical interconnection,” Laser & Photonics Rev. 6, 504–525 (2012).
[Crossref]

W. Bogaerts, P. de Heyn, T. van Vaerenbergh, K. de Vos, S. Kumar Selvaraja, T. Claes, P. Dumon, P. Bienstman, D. van Thourhout, and R. Baets, “Silicon microring resonators,” Laser Photonics Rev. 6, 47–73 (2012).
[Crossref]

2011 (1)

J. Wu, S. Kim, W. Chen, A. Carlson, K.-C. Hwang, Y. Huang, and J. A. Rogers, “Mechanics of reversible adhesion,” Soft Matter 7, 8657 (2011).
[Crossref]

2010 (2)

P. L. Stiles, “Direct deposition of micro- and nanoscale hydrogels using Dip Pen Nanolithography (DPN),” Nat. Method 7, i–ii (2010).
[Crossref]

G. Roelkens, L. Liu, D. Liang, R. Jones, A. Fang, B. Koch, and J. Bowers, “III–V/silicon photonics for on-chip and intra-chip optical interconnects,” Laser Photonics Rev. 4, 751–779 (2010).
[Crossref]

2008 (1)

M. Gnan, S. Thoms, D. Macintyre, R. De La Rue, and M. Sorel, “Fabrication of low-loss photonic wires in silicon-on-insulator using hydrogen silsesquioxane electron-beam resist,” Electron. Lett. 44, 115 (2008).
[Crossref]

2007 (1)

S. Kawashima, M. Imada, K. Ishizaki, and S. Noda, “High-Precision Alignment and Bonding System for the Fabrication of 3-D Nanostructures,” J. Microelectromechanical Syst. 16, 1140–1144 (2007).
[Crossref]

2006 (1)

M. A. Meitl, Z.-T. Zhu, V. Kumar, K. J. Lee, X. Feng, Y. Y. Huang, I. Adesida, R. G. Nuzzo, and J. A. Rogers, “Transfer printing by kinetic control of adhesion to an elastomeric stamp,” Nat. Mater. 5, 33–38 (2006).
[Crossref]

2004 (1)

E. Anderson, “Sub-pixel alignment for direct-write electron beam lithography,” Microelectron. Eng. 73–74, 74–79 (2004).
[Crossref]

1996 (1)

A. Broers, A. Hoole, and J. Ryan, “Electron beam lithography—resolution limits,” Microelectron. Eng. 32, 131–142 (1996).
[Crossref]

Abassi, A.

G. Roelkens, A. Abassi, P. Cardile, U. Dave, A. de Groote, Y. de Koninck, S. Dhoore, X. Fu, A. Gassenq, N. Hattasan, Q. Huang, S. Kumari, S. Keyvaninia, B. Kuyken, L. Li, P. Mechet, M. Muneeb, D. Sanchez, H. Shao, T. Spuesens, A. Subramanian, S. Uvin, M. Tassaert, K. van Gasse, J. Verbist, R. Wang, Z. Wang, J. Zhang, J. van Campenhout, X. Yin, J. Bauwelinck, G. Morthier, R. Baets, and D. van Thourhout, “III–V-on-Silicon Photonic Devices for Optical Communication and Sensing,” Photonics. 2, 969–1004 (2015).
[Crossref]

Abbasi, A.

N. Ye, G. Muliuk, J. Zhang, A. Abbasi, A. J. Trindade, C. Bower, D. V. Thourhout, and G. Roelkens, “Transfer print integration of waveguide-coupled germanium photodiodes onto passive silicon photonic ICs,” J. Light. Technol. 36, 1249–1254 (2018).
[Crossref]

J. Zhang, A. D. Groote, A. Abbasi, R. Loi, J. O’Callaghan, B. Corbett, A. J. Trindade, C. A. Bower, and G. Roelkens, “Silicon photonics fiber-to-the-home transceiver array based on transfer-printing-based integration of III–V photodetectors,” Opt. Express 25, 14290 (2017).
[Crossref] [PubMed]

Adesida, I.

M. A. Meitl, Z.-T. Zhu, V. Kumar, K. J. Lee, X. Feng, Y. Y. Huang, I. Adesida, R. G. Nuzzo, and J. A. Rogers, “Transfer printing by kinetic control of adhesion to an elastomeric stamp,” Nat. Mater. 5, 33–38 (2006).
[Crossref]

Ahmed, T.

T. Ahmed, T. Lu, T. Butler, J. Kulick, G. Bernstein, A. Hoffman, D. Hall, and S. Howard, “Mid-Infrared Waveguide Array Inter-chip Coupling using Optical Quilt Packaging,” IEEE Photonics Technol. Lett. 1135, 1 (2017).

T. Ahmed, A. A. Khan, G. Vigil, J. M. Kulick, G. H. Bernstein, A. J. Hoffman, and S. S. Howard, “Optical quilt packaging: A new chip-to-chip optical coupling and alignment process for modular sensors,” in “CLEO: 2014,” (OSA, 2014).

Amann, M.-C.

R. Wang, A. Vasiliev, M. Muneeb, A. Malik, S. Sprengel, G. Boehm, M.-C. Amann, I. Šimonytė, A. Vizbaras, K. Vizbaras, R. Baets, and G. Roelkens, “III–V-on-Silicon Photonic Integrated Circuits for Spectroscopic Sensing in the 2–4 μm Wavelength Range,” Sensors. 17, 1788 (2017).
[Crossref]

Anderson, E.

E. Anderson, “Sub-pixel alignment for direct-write electron beam lithography,” Microelectron. Eng. 73–74, 74–79 (2004).
[Crossref]

Baets, R.

R. Wang, A. Vasiliev, M. Muneeb, A. Malik, S. Sprengel, G. Boehm, M.-C. Amann, I. Šimonytė, A. Vizbaras, K. Vizbaras, R. Baets, and G. Roelkens, “III–V-on-Silicon Photonic Integrated Circuits for Spectroscopic Sensing in the 2–4 μm Wavelength Range,” Sensors. 17, 1788 (2017).
[Crossref]

A. De Groote, P. Cardile, A. Z. Subramanian, A. M. Fecioru, C. Bower, D. Delbeke, R. Baets, and G. Roelkens, “Transfer-printing-based integration of single-mode waveguide-coupled III–V-on-silicon broadband light emitters,” Opt. Express 24, 13754 (2016).
[Crossref] [PubMed]

G. Roelkens, A. Abassi, P. Cardile, U. Dave, A. de Groote, Y. de Koninck, S. Dhoore, X. Fu, A. Gassenq, N. Hattasan, Q. Huang, S. Kumari, S. Keyvaninia, B. Kuyken, L. Li, P. Mechet, M. Muneeb, D. Sanchez, H. Shao, T. Spuesens, A. Subramanian, S. Uvin, M. Tassaert, K. van Gasse, J. Verbist, R. Wang, Z. Wang, J. Zhang, J. van Campenhout, X. Yin, J. Bauwelinck, G. Morthier, R. Baets, and D. van Thourhout, “III–V-on-Silicon Photonic Devices for Optical Communication and Sensing,” Photonics. 2, 969–1004 (2015).
[Crossref]

W. Bogaerts, P. de Heyn, T. van Vaerenbergh, K. de Vos, S. Kumar Selvaraja, T. Claes, P. Dumon, P. Bienstman, D. van Thourhout, and R. Baets, “Silicon microring resonators,” Laser Photonics Rev. 6, 47–73 (2012).
[Crossref]

Bauters, J. F.

M. J. R. Heck, J. F. Bauters, M. L. Davenport, J. K. Doylend, S. Jain, G. Kurczveil, S. Srinivasan, and J. E. Bowers, “Hybrid Silicon Photonic Integrated Circuit Technology,” IEEE J. Sel. Top. Quantum Electron. 19, 6100117 (2013).
[Crossref]

Bauwelinck, J.

G. Roelkens, A. Abassi, P. Cardile, U. Dave, A. de Groote, Y. de Koninck, S. Dhoore, X. Fu, A. Gassenq, N. Hattasan, Q. Huang, S. Kumari, S. Keyvaninia, B. Kuyken, L. Li, P. Mechet, M. Muneeb, D. Sanchez, H. Shao, T. Spuesens, A. Subramanian, S. Uvin, M. Tassaert, K. van Gasse, J. Verbist, R. Wang, Z. Wang, J. Zhang, J. van Campenhout, X. Yin, J. Bauwelinck, G. Morthier, R. Baets, and D. van Thourhout, “III–V-on-Silicon Photonic Devices for Optical Communication and Sensing,” Photonics. 2, 969–1004 (2015).
[Crossref]

Beaudoin, G.

G. Crosnier, D. Sanchez, S. Bouchoule, P. Monnier, G. Beaudoin, I. Sagnes, R. Raj, and F. Raineri, “Hybrid indium phosphide-on-silicon nanolaser diode,” Nat. Photonics 11, 297–300 (2017).
[Crossref]

Beausoleil, R. G.

D. Liang, X. Huang, G. Kurczveil, M. Fiorentino, and R. G. Beausoleil, “Integrated finely tunable microring laser on silicon,” Nat. Photonics 10, 719–722 (2016).
[Crossref]

Bernstein, G.

T. Ahmed, T. Lu, T. Butler, J. Kulick, G. Bernstein, A. Hoffman, D. Hall, and S. Howard, “Mid-Infrared Waveguide Array Inter-chip Coupling using Optical Quilt Packaging,” IEEE Photonics Technol. Lett. 1135, 1 (2017).

Bernstein, G. H.

T. Ahmed, A. A. Khan, G. Vigil, J. M. Kulick, G. H. Bernstein, A. J. Hoffman, and S. S. Howard, “Optical quilt packaging: A new chip-to-chip optical coupling and alignment process for modular sensors,” in “CLEO: 2014,” (OSA, 2014).

Bienstman, P.

W. Bogaerts, P. de Heyn, T. van Vaerenbergh, K. de Vos, S. Kumar Selvaraja, T. Claes, P. Dumon, P. Bienstman, D. van Thourhout, and R. Baets, “Silicon microring resonators,” Laser Photonics Rev. 6, 47–73 (2012).
[Crossref]

Boehm, G.

R. Wang, A. Vasiliev, M. Muneeb, A. Malik, S. Sprengel, G. Boehm, M.-C. Amann, I. Šimonytė, A. Vizbaras, K. Vizbaras, R. Baets, and G. Roelkens, “III–V-on-Silicon Photonic Integrated Circuits for Spectroscopic Sensing in the 2–4 μm Wavelength Range,” Sensors. 17, 1788 (2017).
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Bogaerts, W.

W. Bogaerts, P. de Heyn, T. van Vaerenbergh, K. de Vos, S. Kumar Selvaraja, T. Claes, P. Dumon, P. Bienstman, D. van Thourhout, and R. Baets, “Silicon microring resonators,” Laser Photonics Rev. 6, 47–73 (2012).
[Crossref]

Bonafede, S.

C. Prevatte, E. Radauscher, M. A. Meitl, D. Gomez, K. Ghosal, S. Bonafede, B. Raymond, T. Moore, A. J. Trindade, P. Hines, and C. A. Bower, “Miniature Heterogeneous Fan-Out Packages for High-Performance, Large-Format Systems,” IEEE 5, A23–A29 (2017).

Bouchoule, S.

G. Crosnier, D. Sanchez, S. Bouchoule, P. Monnier, G. Beaudoin, I. Sagnes, R. Raj, and F. Raineri, “Hybrid indium phosphide-on-silicon nanolaser diode,” Nat. Photonics 11, 297–300 (2017).
[Crossref]

Bovington, J.

Bower, C.

Bower, C. A.

J. Zhang, A. D. Groote, A. Abbasi, R. Loi, J. O’Callaghan, B. Corbett, A. J. Trindade, C. A. Bower, and G. Roelkens, “Silicon photonics fiber-to-the-home transceiver array based on transfer-printing-based integration of III–V photodetectors,” Opt. Express 25, 14290 (2017).
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C. Prevatte, E. Radauscher, M. A. Meitl, D. Gomez, K. Ghosal, S. Bonafede, B. Raymond, T. Moore, A. J. Trindade, P. Hines, and C. A. Bower, “Miniature Heterogeneous Fan-Out Packages for High-Performance, Large-Format Systems,” IEEE 5, A23–A29 (2017).

J. Yoon, S. M. Lee, D. Kang, M. A. Meitl, C. A. Bower, and J. A. Rogers, “Heterogeneously Integrated Optoelectronic Devices Enabled by Micro-Transfer Printing,” Adv. Opt. Mater. 3, 1313–1335 (2015).
[Crossref]

C. A. Bower, E. Menard, and P. E. Garrou, “Transfer printing: An approach for massively parallel assembly of microscale devices,” in “2008 58th Electronic Components and Technology Conference,” (IEEE, 2008).

Bowers, J.

G. Roelkens, L. Liu, D. Liang, R. Jones, A. Fang, B. Koch, and J. Bowers, “III–V/silicon photonics for on-chip and intra-chip optical interconnects,” Laser Photonics Rev. 4, 751–779 (2010).
[Crossref]

Bowers, J. E.

N. Volet, A. Spott, E. J. Stanton, M. L. Davenport, L. Chang, J. D. Peters, T. C. Briles, I. Vurgaftman, J. R. Meyer, and J. E. Bowers, “Semiconductor optical amplifiers at 2.0-μm wavelength on silicon,” Laser & Photonics Rev. 11, 1600165 (2017).
[Crossref]

M. J. R. Heck, J. F. Bauters, M. L. Davenport, J. K. Doylend, S. Jain, G. Kurczveil, S. Srinivasan, and J. E. Bowers, “Hybrid Silicon Photonic Integrated Circuit Technology,” IEEE J. Sel. Top. Quantum Electron. 19, 6100117 (2013).
[Crossref]

Briles, T. C.

N. Volet, A. Spott, E. J. Stanton, M. L. Davenport, L. Chang, J. D. Peters, T. C. Briles, I. Vurgaftman, J. R. Meyer, and J. E. Bowers, “Semiconductor optical amplifiers at 2.0-μm wavelength on silicon,” Laser & Photonics Rev. 11, 1600165 (2017).
[Crossref]

Broers, A.

A. Broers, A. Hoole, and J. Ryan, “Electron beam lithography—resolution limits,” Microelectron. Eng. 32, 131–142 (1996).
[Crossref]

Butler, T.

T. Ahmed, T. Lu, T. Butler, J. Kulick, G. Bernstein, A. Hoffman, D. Hall, and S. Howard, “Mid-Infrared Waveguide Array Inter-chip Coupling using Optical Quilt Packaging,” IEEE Photonics Technol. Lett. 1135, 1 (2017).

Cantarella, G.

D. Jevtics, A. Hurtado, B. Guilhabert, J. McPhillimy, G. Cantarella, Q. Gao, H. H. Tan, C. Jagadish, M. J. Strain, and M. D. Dawson, “Integration of semiconductor nanowire lasers with polymeric waveguide devices on a mechanically flexible substrate,” Nano Lett. 17, 5990–5994 (2017).
[Crossref] [PubMed]

Cardile, P.

A. De Groote, P. Cardile, A. Z. Subramanian, A. M. Fecioru, C. Bower, D. Delbeke, R. Baets, and G. Roelkens, “Transfer-printing-based integration of single-mode waveguide-coupled III–V-on-silicon broadband light emitters,” Opt. Express 24, 13754 (2016).
[Crossref] [PubMed]

G. Roelkens, A. Abassi, P. Cardile, U. Dave, A. de Groote, Y. de Koninck, S. Dhoore, X. Fu, A. Gassenq, N. Hattasan, Q. Huang, S. Kumari, S. Keyvaninia, B. Kuyken, L. Li, P. Mechet, M. Muneeb, D. Sanchez, H. Shao, T. Spuesens, A. Subramanian, S. Uvin, M. Tassaert, K. van Gasse, J. Verbist, R. Wang, Z. Wang, J. Zhang, J. van Campenhout, X. Yin, J. Bauwelinck, G. Morthier, R. Baets, and D. van Thourhout, “III–V-on-Silicon Photonic Devices for Optical Communication and Sensing,” Photonics. 2, 969–1004 (2015).
[Crossref]

Carlson, A.

J. Wu, S. Kim, W. Chen, A. Carlson, K.-C. Hwang, Y. Huang, and J. A. Rogers, “Mechanics of reversible adhesion,” Soft Matter 7, 8657 (2011).
[Crossref]

Chang, L.

N. Volet, A. Spott, E. J. Stanton, M. L. Davenport, L. Chang, J. D. Peters, T. C. Briles, I. Vurgaftman, J. R. Meyer, and J. E. Bowers, “Semiconductor optical amplifiers at 2.0-μm wavelength on silicon,” Laser & Photonics Rev. 11, 1600165 (2017).
[Crossref]

Chen, K.

K. Chen, Q. Huang, J. Zhang, J. Cheng, X. Fu, C. Zhang, K. Ma, Y. Shi, D. V. Thourhout, G. Roelkens, L. Liu, and S. He, “Wavelength-multiplexed duplex transceiver based on III–v/si hybrid integration for off-chip and on-chip optical interconnects,” IEEE Photonics J. 8, 1–10 (2016).

Chen, W.

J. Wu, S. Kim, W. Chen, A. Carlson, K.-C. Hwang, Y. Huang, and J. A. Rogers, “Mechanics of reversible adhesion,” Soft Matter 7, 8657 (2011).
[Crossref]

Cheng, J.

K. Chen, Q. Huang, J. Zhang, J. Cheng, X. Fu, C. Zhang, K. Ma, Y. Shi, D. V. Thourhout, G. Roelkens, L. Liu, and S. He, “Wavelength-multiplexed duplex transceiver based on III–v/si hybrid integration for off-chip and on-chip optical interconnects,” IEEE Photonics J. 8, 1–10 (2016).

Claes, T.

W. Bogaerts, P. de Heyn, T. van Vaerenbergh, K. de Vos, S. Kumar Selvaraja, T. Claes, P. Dumon, P. Bienstman, D. van Thourhout, and R. Baets, “Silicon microring resonators,” Laser Photonics Rev. 6, 47–73 (2012).
[Crossref]

Corbett, B.

Crosnier, G.

G. Crosnier, D. Sanchez, S. Bouchoule, P. Monnier, G. Beaudoin, I. Sagnes, R. Raj, and F. Raineri, “Hybrid indium phosphide-on-silicon nanolaser diode,” Nat. Photonics 11, 297–300 (2017).
[Crossref]

Cunningham, J. E.

Dave, U.

G. Roelkens, A. Abassi, P. Cardile, U. Dave, A. de Groote, Y. de Koninck, S. Dhoore, X. Fu, A. Gassenq, N. Hattasan, Q. Huang, S. Kumari, S. Keyvaninia, B. Kuyken, L. Li, P. Mechet, M. Muneeb, D. Sanchez, H. Shao, T. Spuesens, A. Subramanian, S. Uvin, M. Tassaert, K. van Gasse, J. Verbist, R. Wang, Z. Wang, J. Zhang, J. van Campenhout, X. Yin, J. Bauwelinck, G. Morthier, R. Baets, and D. van Thourhout, “III–V-on-Silicon Photonic Devices for Optical Communication and Sensing,” Photonics. 2, 969–1004 (2015).
[Crossref]

Davenport, M. L.

N. Volet, A. Spott, E. J. Stanton, M. L. Davenport, L. Chang, J. D. Peters, T. C. Briles, I. Vurgaftman, J. R. Meyer, and J. E. Bowers, “Semiconductor optical amplifiers at 2.0-μm wavelength on silicon,” Laser & Photonics Rev. 11, 1600165 (2017).
[Crossref]

M. J. R. Heck, J. F. Bauters, M. L. Davenport, J. K. Doylend, S. Jain, G. Kurczveil, S. Srinivasan, and J. E. Bowers, “Hybrid Silicon Photonic Integrated Circuit Technology,” IEEE J. Sel. Top. Quantum Electron. 19, 6100117 (2013).
[Crossref]

Dawson, M. D.

D. Jevtics, A. Hurtado, B. Guilhabert, J. McPhillimy, G. Cantarella, Q. Gao, H. H. Tan, C. Jagadish, M. J. Strain, and M. D. Dawson, “Integration of semiconductor nanowire lasers with polymeric waveguide devices on a mechanically flexible substrate,” Nano Lett. 17, 5990–5994 (2017).
[Crossref] [PubMed]

A. J. Trindade, B. Guilhabert, E. Y. Xie, R. Ferreira, J. J. D. McKendry, D. Zhu, N. Laurand, E. Gu, D. J. Wallis, I. M. Watson, C. J. Humphreys, and M. D. Dawson, “Heterogeneous integration of gallium nitride light-emitting diodes on diamond and silica by transfer printing,” Opt. Express 23, 9329–9338 (2015).
[Crossref] [PubMed]

De Groote, A.

A. De Groote, P. Cardile, A. Z. Subramanian, A. M. Fecioru, C. Bower, D. Delbeke, R. Baets, and G. Roelkens, “Transfer-printing-based integration of single-mode waveguide-coupled III–V-on-silicon broadband light emitters,” Opt. Express 24, 13754 (2016).
[Crossref] [PubMed]

G. Roelkens, A. Abassi, P. Cardile, U. Dave, A. de Groote, Y. de Koninck, S. Dhoore, X. Fu, A. Gassenq, N. Hattasan, Q. Huang, S. Kumari, S. Keyvaninia, B. Kuyken, L. Li, P. Mechet, M. Muneeb, D. Sanchez, H. Shao, T. Spuesens, A. Subramanian, S. Uvin, M. Tassaert, K. van Gasse, J. Verbist, R. Wang, Z. Wang, J. Zhang, J. van Campenhout, X. Yin, J. Bauwelinck, G. Morthier, R. Baets, and D. van Thourhout, “III–V-on-Silicon Photonic Devices for Optical Communication and Sensing,” Photonics. 2, 969–1004 (2015).
[Crossref]

de Heyn, P.

W. Bogaerts, P. de Heyn, T. van Vaerenbergh, K. de Vos, S. Kumar Selvaraja, T. Claes, P. Dumon, P. Bienstman, D. van Thourhout, and R. Baets, “Silicon microring resonators,” Laser Photonics Rev. 6, 47–73 (2012).
[Crossref]

de Koninck, Y.

G. Roelkens, A. Abassi, P. Cardile, U. Dave, A. de Groote, Y. de Koninck, S. Dhoore, X. Fu, A. Gassenq, N. Hattasan, Q. Huang, S. Kumari, S. Keyvaninia, B. Kuyken, L. Li, P. Mechet, M. Muneeb, D. Sanchez, H. Shao, T. Spuesens, A. Subramanian, S. Uvin, M. Tassaert, K. van Gasse, J. Verbist, R. Wang, Z. Wang, J. Zhang, J. van Campenhout, X. Yin, J. Bauwelinck, G. Morthier, R. Baets, and D. van Thourhout, “III–V-on-Silicon Photonic Devices for Optical Communication and Sensing,” Photonics. 2, 969–1004 (2015).
[Crossref]

De La Rue, R.

M. Gnan, S. Thoms, D. Macintyre, R. De La Rue, and M. Sorel, “Fabrication of low-loss photonic wires in silicon-on-insulator using hydrogen silsesquioxane electron-beam resist,” Electron. Lett. 44, 115 (2008).
[Crossref]

de Vos, K.

W. Bogaerts, P. de Heyn, T. van Vaerenbergh, K. de Vos, S. Kumar Selvaraja, T. Claes, P. Dumon, P. Bienstman, D. van Thourhout, and R. Baets, “Silicon microring resonators,” Laser Photonics Rev. 6, 47–73 (2012).
[Crossref]

Delbeke, D.

Dhoore, S.

G. Roelkens, A. Abassi, P. Cardile, U. Dave, A. de Groote, Y. de Koninck, S. Dhoore, X. Fu, A. Gassenq, N. Hattasan, Q. Huang, S. Kumari, S. Keyvaninia, B. Kuyken, L. Li, P. Mechet, M. Muneeb, D. Sanchez, H. Shao, T. Spuesens, A. Subramanian, S. Uvin, M. Tassaert, K. van Gasse, J. Verbist, R. Wang, Z. Wang, J. Zhang, J. van Campenhout, X. Yin, J. Bauwelinck, G. Morthier, R. Baets, and D. van Thourhout, “III–V-on-Silicon Photonic Devices for Optical Communication and Sensing,” Photonics. 2, 969–1004 (2015).
[Crossref]

Djordjevic, S. S.

Doylend, J.

J. Doylend and A. Knights, “The evolution of silicon photonics as an enabling technology for optical interconnection,” Laser & Photonics Rev. 6, 504–525 (2012).
[Crossref]

Doylend, J. K.

M. J. R. Heck, J. F. Bauters, M. L. Davenport, J. K. Doylend, S. Jain, G. Kurczveil, S. Srinivasan, and J. E. Bowers, “Hybrid Silicon Photonic Integrated Circuit Technology,” IEEE J. Sel. Top. Quantum Electron. 19, 6100117 (2013).
[Crossref]

Dumon, P.

W. Bogaerts, P. de Heyn, T. van Vaerenbergh, K. de Vos, S. Kumar Selvaraja, T. Claes, P. Dumon, P. Bienstman, D. van Thourhout, and R. Baets, “Silicon microring resonators,” Laser Photonics Rev. 6, 47–73 (2012).
[Crossref]

Fang, A.

G. Roelkens, L. Liu, D. Liang, R. Jones, A. Fang, B. Koch, and J. Bowers, “III–V/silicon photonics for on-chip and intra-chip optical interconnects,” Laser Photonics Rev. 4, 751–779 (2010).
[Crossref]

Fecioru, A. M.

Feng, X.

M. A. Meitl, Z.-T. Zhu, V. Kumar, K. J. Lee, X. Feng, Y. Y. Huang, I. Adesida, R. G. Nuzzo, and J. A. Rogers, “Transfer printing by kinetic control of adhesion to an elastomeric stamp,” Nat. Mater. 5, 33–38 (2006).
[Crossref]

Ferreira, R.

Fiorentino, M.

D. Liang, X. Huang, G. Kurczveil, M. Fiorentino, and R. G. Beausoleil, “Integrated finely tunable microring laser on silicon,” Nat. Photonics 10, 719–722 (2016).
[Crossref]

Fu, X.

K. Chen, Q. Huang, J. Zhang, J. Cheng, X. Fu, C. Zhang, K. Ma, Y. Shi, D. V. Thourhout, G. Roelkens, L. Liu, and S. He, “Wavelength-multiplexed duplex transceiver based on III–v/si hybrid integration for off-chip and on-chip optical interconnects,” IEEE Photonics J. 8, 1–10 (2016).

G. Roelkens, A. Abassi, P. Cardile, U. Dave, A. de Groote, Y. de Koninck, S. Dhoore, X. Fu, A. Gassenq, N. Hattasan, Q. Huang, S. Kumari, S. Keyvaninia, B. Kuyken, L. Li, P. Mechet, M. Muneeb, D. Sanchez, H. Shao, T. Spuesens, A. Subramanian, S. Uvin, M. Tassaert, K. van Gasse, J. Verbist, R. Wang, Z. Wang, J. Zhang, J. van Campenhout, X. Yin, J. Bauwelinck, G. Morthier, R. Baets, and D. van Thourhout, “III–V-on-Silicon Photonic Devices for Optical Communication and Sensing,” Photonics. 2, 969–1004 (2015).
[Crossref]

Gao, Q.

D. Jevtics, A. Hurtado, B. Guilhabert, J. McPhillimy, G. Cantarella, Q. Gao, H. H. Tan, C. Jagadish, M. J. Strain, and M. D. Dawson, “Integration of semiconductor nanowire lasers with polymeric waveguide devices on a mechanically flexible substrate,” Nano Lett. 17, 5990–5994 (2017).
[Crossref] [PubMed]

Garrou, P. E.

C. A. Bower, E. Menard, and P. E. Garrou, “Transfer printing: An approach for massively parallel assembly of microscale devices,” in “2008 58th Electronic Components and Technology Conference,” (IEEE, 2008).

Gassenq, A.

G. Roelkens, A. Abassi, P. Cardile, U. Dave, A. de Groote, Y. de Koninck, S. Dhoore, X. Fu, A. Gassenq, N. Hattasan, Q. Huang, S. Kumari, S. Keyvaninia, B. Kuyken, L. Li, P. Mechet, M. Muneeb, D. Sanchez, H. Shao, T. Spuesens, A. Subramanian, S. Uvin, M. Tassaert, K. van Gasse, J. Verbist, R. Wang, Z. Wang, J. Zhang, J. van Campenhout, X. Yin, J. Bauwelinck, G. Morthier, R. Baets, and D. van Thourhout, “III–V-on-Silicon Photonic Devices for Optical Communication and Sensing,” Photonics. 2, 969–1004 (2015).
[Crossref]

Ghosal, K.

C. Prevatte, E. Radauscher, M. A. Meitl, D. Gomez, K. Ghosal, S. Bonafede, B. Raymond, T. Moore, A. J. Trindade, P. Hines, and C. A. Bower, “Miniature Heterogeneous Fan-Out Packages for High-Performance, Large-Format Systems,” IEEE 5, A23–A29 (2017).

Gnan, M.

M. Gnan, S. Thoms, D. Macintyre, R. De La Rue, and M. Sorel, “Fabrication of low-loss photonic wires in silicon-on-insulator using hydrogen silsesquioxane electron-beam resist,” Electron. Lett. 44, 115 (2008).
[Crossref]

Gomez, D.

C. Prevatte, E. Radauscher, M. A. Meitl, D. Gomez, K. Ghosal, S. Bonafede, B. Raymond, T. Moore, A. J. Trindade, P. Hines, and C. A. Bower, “Miniature Heterogeneous Fan-Out Packages for High-Performance, Large-Format Systems,” IEEE 5, A23–A29 (2017).

Groote, A. D.

Gu, E.

Guilhabert, B.

D. Jevtics, A. Hurtado, B. Guilhabert, J. McPhillimy, G. Cantarella, Q. Gao, H. H. Tan, C. Jagadish, M. J. Strain, and M. D. Dawson, “Integration of semiconductor nanowire lasers with polymeric waveguide devices on a mechanically flexible substrate,” Nano Lett. 17, 5990–5994 (2017).
[Crossref] [PubMed]

A. J. Trindade, B. Guilhabert, E. Y. Xie, R. Ferreira, J. J. D. McKendry, D. Zhu, N. Laurand, E. Gu, D. J. Wallis, I. M. Watson, C. J. Humphreys, and M. D. Dawson, “Heterogeneous integration of gallium nitride light-emitting diodes on diamond and silica by transfer printing,” Opt. Express 23, 9329–9338 (2015).
[Crossref] [PubMed]

Hall, D.

T. Ahmed, T. Lu, T. Butler, J. Kulick, G. Bernstein, A. Hoffman, D. Hall, and S. Howard, “Mid-Infrared Waveguide Array Inter-chip Coupling using Optical Quilt Packaging,” IEEE Photonics Technol. Lett. 1135, 1 (2017).

Hattasan, N.

G. Roelkens, A. Abassi, P. Cardile, U. Dave, A. de Groote, Y. de Koninck, S. Dhoore, X. Fu, A. Gassenq, N. Hattasan, Q. Huang, S. Kumari, S. Keyvaninia, B. Kuyken, L. Li, P. Mechet, M. Muneeb, D. Sanchez, H. Shao, T. Spuesens, A. Subramanian, S. Uvin, M. Tassaert, K. van Gasse, J. Verbist, R. Wang, Z. Wang, J. Zhang, J. van Campenhout, X. Yin, J. Bauwelinck, G. Morthier, R. Baets, and D. van Thourhout, “III–V-on-Silicon Photonic Devices for Optical Communication and Sensing,” Photonics. 2, 969–1004 (2015).
[Crossref]

He, S.

K. Chen, Q. Huang, J. Zhang, J. Cheng, X. Fu, C. Zhang, K. Ma, Y. Shi, D. V. Thourhout, G. Roelkens, L. Liu, and S. He, “Wavelength-multiplexed duplex transceiver based on III–v/si hybrid integration for off-chip and on-chip optical interconnects,” IEEE Photonics J. 8, 1–10 (2016).

Heck, M. J. R.

M. J. R. Heck, J. F. Bauters, M. L. Davenport, J. K. Doylend, S. Jain, G. Kurczveil, S. Srinivasan, and J. E. Bowers, “Hybrid Silicon Photonic Integrated Circuit Technology,” IEEE J. Sel. Top. Quantum Electron. 19, 6100117 (2013).
[Crossref]

Hines, P.

C. Prevatte, E. Radauscher, M. A. Meitl, D. Gomez, K. Ghosal, S. Bonafede, B. Raymond, T. Moore, A. J. Trindade, P. Hines, and C. A. Bower, “Miniature Heterogeneous Fan-Out Packages for High-Performance, Large-Format Systems,” IEEE 5, A23–A29 (2017).

Hoffman, A.

T. Ahmed, T. Lu, T. Butler, J. Kulick, G. Bernstein, A. Hoffman, D. Hall, and S. Howard, “Mid-Infrared Waveguide Array Inter-chip Coupling using Optical Quilt Packaging,” IEEE Photonics Technol. Lett. 1135, 1 (2017).

Hoffman, A. J.

T. Ahmed, A. A. Khan, G. Vigil, J. M. Kulick, G. H. Bernstein, A. J. Hoffman, and S. S. Howard, “Optical quilt packaging: A new chip-to-chip optical coupling and alignment process for modular sensors,” in “CLEO: 2014,” (OSA, 2014).

Hoole, A.

A. Broers, A. Hoole, and J. Ryan, “Electron beam lithography—resolution limits,” Microelectron. Eng. 32, 131–142 (1996).
[Crossref]

Howard, S.

T. Ahmed, T. Lu, T. Butler, J. Kulick, G. Bernstein, A. Hoffman, D. Hall, and S. Howard, “Mid-Infrared Waveguide Array Inter-chip Coupling using Optical Quilt Packaging,” IEEE Photonics Technol. Lett. 1135, 1 (2017).

Howard, S. S.

T. Ahmed, A. A. Khan, G. Vigil, J. M. Kulick, G. H. Bernstein, A. J. Hoffman, and S. S. Howard, “Optical quilt packaging: A new chip-to-chip optical coupling and alignment process for modular sensors,” in “CLEO: 2014,” (OSA, 2014).

Huang, Q.

K. Chen, Q. Huang, J. Zhang, J. Cheng, X. Fu, C. Zhang, K. Ma, Y. Shi, D. V. Thourhout, G. Roelkens, L. Liu, and S. He, “Wavelength-multiplexed duplex transceiver based on III–v/si hybrid integration for off-chip and on-chip optical interconnects,” IEEE Photonics J. 8, 1–10 (2016).

G. Roelkens, A. Abassi, P. Cardile, U. Dave, A. de Groote, Y. de Koninck, S. Dhoore, X. Fu, A. Gassenq, N. Hattasan, Q. Huang, S. Kumari, S. Keyvaninia, B. Kuyken, L. Li, P. Mechet, M. Muneeb, D. Sanchez, H. Shao, T. Spuesens, A. Subramanian, S. Uvin, M. Tassaert, K. van Gasse, J. Verbist, R. Wang, Z. Wang, J. Zhang, J. van Campenhout, X. Yin, J. Bauwelinck, G. Morthier, R. Baets, and D. van Thourhout, “III–V-on-Silicon Photonic Devices for Optical Communication and Sensing,” Photonics. 2, 969–1004 (2015).
[Crossref]

Huang, X.

D. Liang, X. Huang, G. Kurczveil, M. Fiorentino, and R. G. Beausoleil, “Integrated finely tunable microring laser on silicon,” Nat. Photonics 10, 719–722 (2016).
[Crossref]

Huang, Y.

J. Wu, S. Kim, W. Chen, A. Carlson, K.-C. Hwang, Y. Huang, and J. A. Rogers, “Mechanics of reversible adhesion,” Soft Matter 7, 8657 (2011).
[Crossref]

Huang, Y. Y.

M. A. Meitl, Z.-T. Zhu, V. Kumar, K. J. Lee, X. Feng, Y. Y. Huang, I. Adesida, R. G. Nuzzo, and J. A. Rogers, “Transfer printing by kinetic control of adhesion to an elastomeric stamp,” Nat. Mater. 5, 33–38 (2006).
[Crossref]

Humphreys, C. J.

Hurtado, A.

D. Jevtics, A. Hurtado, B. Guilhabert, J. McPhillimy, G. Cantarella, Q. Gao, H. H. Tan, C. Jagadish, M. J. Strain, and M. D. Dawson, “Integration of semiconductor nanowire lasers with polymeric waveguide devices on a mechanically flexible substrate,” Nano Lett. 17, 5990–5994 (2017).
[Crossref] [PubMed]

Hwang, K.-C.

J. Wu, S. Kim, W. Chen, A. Carlson, K.-C. Hwang, Y. Huang, and J. A. Rogers, “Mechanics of reversible adhesion,” Soft Matter 7, 8657 (2011).
[Crossref]

Imada, M.

S. Kawashima, M. Imada, K. Ishizaki, and S. Noda, “High-Precision Alignment and Bonding System for the Fabrication of 3-D Nanostructures,” J. Microelectromechanical Syst. 16, 1140–1144 (2007).
[Crossref]

Ishizaki, K.

S. Kawashima, M. Imada, K. Ishizaki, and S. Noda, “High-Precision Alignment and Bonding System for the Fabrication of 3-D Nanostructures,” J. Microelectromechanical Syst. 16, 1140–1144 (2007).
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Jagadish, C.

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G. Roelkens, A. Abassi, P. Cardile, U. Dave, A. de Groote, Y. de Koninck, S. Dhoore, X. Fu, A. Gassenq, N. Hattasan, Q. Huang, S. Kumari, S. Keyvaninia, B. Kuyken, L. Li, P. Mechet, M. Muneeb, D. Sanchez, H. Shao, T. Spuesens, A. Subramanian, S. Uvin, M. Tassaert, K. van Gasse, J. Verbist, R. Wang, Z. Wang, J. Zhang, J. van Campenhout, X. Yin, J. Bauwelinck, G. Morthier, R. Baets, and D. van Thourhout, “III–V-on-Silicon Photonic Devices for Optical Communication and Sensing,” Photonics. 2, 969–1004 (2015).
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G. Roelkens, L. Liu, D. Liang, R. Jones, A. Fang, B. Koch, and J. Bowers, “III–V/silicon photonics for on-chip and intra-chip optical interconnects,” Laser Photonics Rev. 4, 751–779 (2010).
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T. Ahmed, A. A. Khan, G. Vigil, J. M. Kulick, G. H. Bernstein, A. J. Hoffman, and S. S. Howard, “Optical quilt packaging: A new chip-to-chip optical coupling and alignment process for modular sensors,” in “CLEO: 2014,” (OSA, 2014).

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M. A. Meitl, Z.-T. Zhu, V. Kumar, K. J. Lee, X. Feng, Y. Y. Huang, I. Adesida, R. G. Nuzzo, and J. A. Rogers, “Transfer printing by kinetic control of adhesion to an elastomeric stamp,” Nat. Mater. 5, 33–38 (2006).
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G. Roelkens, A. Abassi, P. Cardile, U. Dave, A. de Groote, Y. de Koninck, S. Dhoore, X. Fu, A. Gassenq, N. Hattasan, Q. Huang, S. Kumari, S. Keyvaninia, B. Kuyken, L. Li, P. Mechet, M. Muneeb, D. Sanchez, H. Shao, T. Spuesens, A. Subramanian, S. Uvin, M. Tassaert, K. van Gasse, J. Verbist, R. Wang, Z. Wang, J. Zhang, J. van Campenhout, X. Yin, J. Bauwelinck, G. Morthier, R. Baets, and D. van Thourhout, “III–V-on-Silicon Photonic Devices for Optical Communication and Sensing,” Photonics. 2, 969–1004 (2015).
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Lee, D. Y.

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M. A. Meitl, Z.-T. Zhu, V. Kumar, K. J. Lee, X. Feng, Y. Y. Huang, I. Adesida, R. G. Nuzzo, and J. A. Rogers, “Transfer printing by kinetic control of adhesion to an elastomeric stamp,” Nat. Mater. 5, 33–38 (2006).
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J. Yoon, S. M. Lee, D. Kang, M. A. Meitl, C. A. Bower, and J. A. Rogers, “Heterogeneously Integrated Optoelectronic Devices Enabled by Micro-Transfer Printing,” Adv. Opt. Mater. 3, 1313–1335 (2015).
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G. Roelkens, A. Abassi, P. Cardile, U. Dave, A. de Groote, Y. de Koninck, S. Dhoore, X. Fu, A. Gassenq, N. Hattasan, Q. Huang, S. Kumari, S. Keyvaninia, B. Kuyken, L. Li, P. Mechet, M. Muneeb, D. Sanchez, H. Shao, T. Spuesens, A. Subramanian, S. Uvin, M. Tassaert, K. van Gasse, J. Verbist, R. Wang, Z. Wang, J. Zhang, J. van Campenhout, X. Yin, J. Bauwelinck, G. Morthier, R. Baets, and D. van Thourhout, “III–V-on-Silicon Photonic Devices for Optical Communication and Sensing,” Photonics. 2, 969–1004 (2015).
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Liu, L.

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G. Roelkens, L. Liu, D. Liang, R. Jones, A. Fang, B. Koch, and J. Bowers, “III–V/silicon photonics for on-chip and intra-chip optical interconnects,” Laser Photonics Rev. 4, 751–779 (2010).
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Ma, K.

K. Chen, Q. Huang, J. Zhang, J. Cheng, X. Fu, C. Zhang, K. Ma, Y. Shi, D. V. Thourhout, G. Roelkens, L. Liu, and S. He, “Wavelength-multiplexed duplex transceiver based on III–v/si hybrid integration for off-chip and on-chip optical interconnects,” IEEE Photonics J. 8, 1–10 (2016).

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G. Roelkens, A. Abassi, P. Cardile, U. Dave, A. de Groote, Y. de Koninck, S. Dhoore, X. Fu, A. Gassenq, N. Hattasan, Q. Huang, S. Kumari, S. Keyvaninia, B. Kuyken, L. Li, P. Mechet, M. Muneeb, D. Sanchez, H. Shao, T. Spuesens, A. Subramanian, S. Uvin, M. Tassaert, K. van Gasse, J. Verbist, R. Wang, Z. Wang, J. Zhang, J. van Campenhout, X. Yin, J. Bauwelinck, G. Morthier, R. Baets, and D. van Thourhout, “III–V-on-Silicon Photonic Devices for Optical Communication and Sensing,” Photonics. 2, 969–1004 (2015).
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C. Prevatte, E. Radauscher, M. A. Meitl, D. Gomez, K. Ghosal, S. Bonafede, B. Raymond, T. Moore, A. J. Trindade, P. Hines, and C. A. Bower, “Miniature Heterogeneous Fan-Out Packages for High-Performance, Large-Format Systems,” IEEE 5, A23–A29 (2017).

J. Yoon, S. M. Lee, D. Kang, M. A. Meitl, C. A. Bower, and J. A. Rogers, “Heterogeneously Integrated Optoelectronic Devices Enabled by Micro-Transfer Printing,” Adv. Opt. Mater. 3, 1313–1335 (2015).
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M. A. Meitl, Z.-T. Zhu, V. Kumar, K. J. Lee, X. Feng, Y. Y. Huang, I. Adesida, R. G. Nuzzo, and J. A. Rogers, “Transfer printing by kinetic control of adhesion to an elastomeric stamp,” Nat. Mater. 5, 33–38 (2006).
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Moore, T.

C. Prevatte, E. Radauscher, M. A. Meitl, D. Gomez, K. Ghosal, S. Bonafede, B. Raymond, T. Moore, A. J. Trindade, P. Hines, and C. A. Bower, “Miniature Heterogeneous Fan-Out Packages for High-Performance, Large-Format Systems,” IEEE 5, A23–A29 (2017).

Morthier, G.

G. Roelkens, A. Abassi, P. Cardile, U. Dave, A. de Groote, Y. de Koninck, S. Dhoore, X. Fu, A. Gassenq, N. Hattasan, Q. Huang, S. Kumari, S. Keyvaninia, B. Kuyken, L. Li, P. Mechet, M. Muneeb, D. Sanchez, H. Shao, T. Spuesens, A. Subramanian, S. Uvin, M. Tassaert, K. van Gasse, J. Verbist, R. Wang, Z. Wang, J. Zhang, J. van Campenhout, X. Yin, J. Bauwelinck, G. Morthier, R. Baets, and D. van Thourhout, “III–V-on-Silicon Photonic Devices for Optical Communication and Sensing,” Photonics. 2, 969–1004 (2015).
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N. Ye, G. Muliuk, J. Zhang, A. Abbasi, A. J. Trindade, C. Bower, D. V. Thourhout, and G. Roelkens, “Transfer print integration of waveguide-coupled germanium photodiodes onto passive silicon photonic ICs,” J. Light. Technol. 36, 1249–1254 (2018).
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N. Ye, G. Muliuk, A. J. Trindade, C. Bower, J. Zhang, S. Uvin, D. V. Thourhout, and G. Roelkens, “High-alignment-accuracy transfer printing of passive silicon waveguide structures,” Opt. Express 26, 2023 (2018).
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Muneeb, M.

R. Wang, A. Vasiliev, M. Muneeb, A. Malik, S. Sprengel, G. Boehm, M.-C. Amann, I. Šimonytė, A. Vizbaras, K. Vizbaras, R. Baets, and G. Roelkens, “III–V-on-Silicon Photonic Integrated Circuits for Spectroscopic Sensing in the 2–4 μm Wavelength Range,” Sensors. 17, 1788 (2017).
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G. Roelkens, A. Abassi, P. Cardile, U. Dave, A. de Groote, Y. de Koninck, S. Dhoore, X. Fu, A. Gassenq, N. Hattasan, Q. Huang, S. Kumari, S. Keyvaninia, B. Kuyken, L. Li, P. Mechet, M. Muneeb, D. Sanchez, H. Shao, T. Spuesens, A. Subramanian, S. Uvin, M. Tassaert, K. van Gasse, J. Verbist, R. Wang, Z. Wang, J. Zhang, J. van Campenhout, X. Yin, J. Bauwelinck, G. Morthier, R. Baets, and D. van Thourhout, “III–V-on-Silicon Photonic Devices for Optical Communication and Sensing,” Photonics. 2, 969–1004 (2015).
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M. A. Meitl, Z.-T. Zhu, V. Kumar, K. J. Lee, X. Feng, Y. Y. Huang, I. Adesida, R. G. Nuzzo, and J. A. Rogers, “Transfer printing by kinetic control of adhesion to an elastomeric stamp,” Nat. Mater. 5, 33–38 (2006).
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Peters, J. D.

N. Volet, A. Spott, E. J. Stanton, M. L. Davenport, L. Chang, J. D. Peters, T. C. Briles, I. Vurgaftman, J. R. Meyer, and J. E. Bowers, “Semiconductor optical amplifiers at 2.0-μm wavelength on silicon,” Laser & Photonics Rev. 11, 1600165 (2017).
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C. Prevatte, E. Radauscher, M. A. Meitl, D. Gomez, K. Ghosal, S. Bonafede, B. Raymond, T. Moore, A. J. Trindade, P. Hines, and C. A. Bower, “Miniature Heterogeneous Fan-Out Packages for High-Performance, Large-Format Systems,” IEEE 5, A23–A29 (2017).

Radauscher, E.

C. Prevatte, E. Radauscher, M. A. Meitl, D. Gomez, K. Ghosal, S. Bonafede, B. Raymond, T. Moore, A. J. Trindade, P. Hines, and C. A. Bower, “Miniature Heterogeneous Fan-Out Packages for High-Performance, Large-Format Systems,” IEEE 5, A23–A29 (2017).

Raineri, F.

G. Crosnier, D. Sanchez, S. Bouchoule, P. Monnier, G. Beaudoin, I. Sagnes, R. Raj, and F. Raineri, “Hybrid indium phosphide-on-silicon nanolaser diode,” Nat. Photonics 11, 297–300 (2017).
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Raj, R.

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C. Prevatte, E. Radauscher, M. A. Meitl, D. Gomez, K. Ghosal, S. Bonafede, B. Raymond, T. Moore, A. J. Trindade, P. Hines, and C. A. Bower, “Miniature Heterogeneous Fan-Out Packages for High-Performance, Large-Format Systems,” IEEE 5, A23–A29 (2017).

Roelkens, G.

N. Ye, G. Muliuk, A. J. Trindade, C. Bower, J. Zhang, S. Uvin, D. V. Thourhout, and G. Roelkens, “High-alignment-accuracy transfer printing of passive silicon waveguide structures,” Opt. Express 26, 2023 (2018).
[Crossref] [PubMed]

N. Ye, G. Muliuk, J. Zhang, A. Abbasi, A. J. Trindade, C. Bower, D. V. Thourhout, and G. Roelkens, “Transfer print integration of waveguide-coupled germanium photodiodes onto passive silicon photonic ICs,” J. Light. Technol. 36, 1249–1254 (2018).
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J. Zhang, A. D. Groote, A. Abbasi, R. Loi, J. O’Callaghan, B. Corbett, A. J. Trindade, C. A. Bower, and G. Roelkens, “Silicon photonics fiber-to-the-home transceiver array based on transfer-printing-based integration of III–V photodetectors,” Opt. Express 25, 14290 (2017).
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R. Wang, A. Vasiliev, M. Muneeb, A. Malik, S. Sprengel, G. Boehm, M.-C. Amann, I. Šimonytė, A. Vizbaras, K. Vizbaras, R. Baets, and G. Roelkens, “III–V-on-Silicon Photonic Integrated Circuits for Spectroscopic Sensing in the 2–4 μm Wavelength Range,” Sensors. 17, 1788 (2017).
[Crossref]

K. Chen, Q. Huang, J. Zhang, J. Cheng, X. Fu, C. Zhang, K. Ma, Y. Shi, D. V. Thourhout, G. Roelkens, L. Liu, and S. He, “Wavelength-multiplexed duplex transceiver based on III–v/si hybrid integration for off-chip and on-chip optical interconnects,” IEEE Photonics J. 8, 1–10 (2016).

A. De Groote, P. Cardile, A. Z. Subramanian, A. M. Fecioru, C. Bower, D. Delbeke, R. Baets, and G. Roelkens, “Transfer-printing-based integration of single-mode waveguide-coupled III–V-on-silicon broadband light emitters,” Opt. Express 24, 13754 (2016).
[Crossref] [PubMed]

G. Roelkens, A. Abassi, P. Cardile, U. Dave, A. de Groote, Y. de Koninck, S. Dhoore, X. Fu, A. Gassenq, N. Hattasan, Q. Huang, S. Kumari, S. Keyvaninia, B. Kuyken, L. Li, P. Mechet, M. Muneeb, D. Sanchez, H. Shao, T. Spuesens, A. Subramanian, S. Uvin, M. Tassaert, K. van Gasse, J. Verbist, R. Wang, Z. Wang, J. Zhang, J. van Campenhout, X. Yin, J. Bauwelinck, G. Morthier, R. Baets, and D. van Thourhout, “III–V-on-Silicon Photonic Devices for Optical Communication and Sensing,” Photonics. 2, 969–1004 (2015).
[Crossref]

G. Roelkens, L. Liu, D. Liang, R. Jones, A. Fang, B. Koch, and J. Bowers, “III–V/silicon photonics for on-chip and intra-chip optical interconnects,” Laser Photonics Rev. 4, 751–779 (2010).
[Crossref]

Rogers, J. A.

J. Yoon, S. M. Lee, D. Kang, M. A. Meitl, C. A. Bower, and J. A. Rogers, “Heterogeneously Integrated Optoelectronic Devices Enabled by Micro-Transfer Printing,” Adv. Opt. Mater. 3, 1313–1335 (2015).
[Crossref]

J. Wu, S. Kim, W. Chen, A. Carlson, K.-C. Hwang, Y. Huang, and J. A. Rogers, “Mechanics of reversible adhesion,” Soft Matter 7, 8657 (2011).
[Crossref]

M. A. Meitl, Z.-T. Zhu, V. Kumar, K. J. Lee, X. Feng, Y. Y. Huang, I. Adesida, R. G. Nuzzo, and J. A. Rogers, “Transfer printing by kinetic control of adhesion to an elastomeric stamp,” Nat. Mater. 5, 33–38 (2006).
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G. Crosnier, D. Sanchez, S. Bouchoule, P. Monnier, G. Beaudoin, I. Sagnes, R. Raj, and F. Raineri, “Hybrid indium phosphide-on-silicon nanolaser diode,” Nat. Photonics 11, 297–300 (2017).
[Crossref]

Sanchez, D.

G. Crosnier, D. Sanchez, S. Bouchoule, P. Monnier, G. Beaudoin, I. Sagnes, R. Raj, and F. Raineri, “Hybrid indium phosphide-on-silicon nanolaser diode,” Nat. Photonics 11, 297–300 (2017).
[Crossref]

G. Roelkens, A. Abassi, P. Cardile, U. Dave, A. de Groote, Y. de Koninck, S. Dhoore, X. Fu, A. Gassenq, N. Hattasan, Q. Huang, S. Kumari, S. Keyvaninia, B. Kuyken, L. Li, P. Mechet, M. Muneeb, D. Sanchez, H. Shao, T. Spuesens, A. Subramanian, S. Uvin, M. Tassaert, K. van Gasse, J. Verbist, R. Wang, Z. Wang, J. Zhang, J. van Campenhout, X. Yin, J. Bauwelinck, G. Morthier, R. Baets, and D. van Thourhout, “III–V-on-Silicon Photonic Devices for Optical Communication and Sensing,” Photonics. 2, 969–1004 (2015).
[Crossref]

Shao, H.

G. Roelkens, A. Abassi, P. Cardile, U. Dave, A. de Groote, Y. de Koninck, S. Dhoore, X. Fu, A. Gassenq, N. Hattasan, Q. Huang, S. Kumari, S. Keyvaninia, B. Kuyken, L. Li, P. Mechet, M. Muneeb, D. Sanchez, H. Shao, T. Spuesens, A. Subramanian, S. Uvin, M. Tassaert, K. van Gasse, J. Verbist, R. Wang, Z. Wang, J. Zhang, J. van Campenhout, X. Yin, J. Bauwelinck, G. Morthier, R. Baets, and D. van Thourhout, “III–V-on-Silicon Photonic Devices for Optical Communication and Sensing,” Photonics. 2, 969–1004 (2015).
[Crossref]

Shi, Y.

K. Chen, Q. Huang, J. Zhang, J. Cheng, X. Fu, C. Zhang, K. Ma, Y. Shi, D. V. Thourhout, G. Roelkens, L. Liu, and S. He, “Wavelength-multiplexed duplex transceiver based on III–v/si hybrid integration for off-chip and on-chip optical interconnects,” IEEE Photonics J. 8, 1–10 (2016).

Shubin, I.

Šimonyte, I.

R. Wang, A. Vasiliev, M. Muneeb, A. Malik, S. Sprengel, G. Boehm, M.-C. Amann, I. Šimonytė, A. Vizbaras, K. Vizbaras, R. Baets, and G. Roelkens, “III–V-on-Silicon Photonic Integrated Circuits for Spectroscopic Sensing in the 2–4 μm Wavelength Range,” Sensors. 17, 1788 (2017).
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R. Wang, A. Vasiliev, M. Muneeb, A. Malik, S. Sprengel, G. Boehm, M.-C. Amann, I. Šimonytė, A. Vizbaras, K. Vizbaras, R. Baets, and G. Roelkens, “III–V-on-Silicon Photonic Integrated Circuits for Spectroscopic Sensing in the 2–4 μm Wavelength Range,” Sensors. 17, 1788 (2017).
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M. J. R. Heck, J. F. Bauters, M. L. Davenport, J. K. Doylend, S. Jain, G. Kurczveil, S. Srinivasan, and J. E. Bowers, “Hybrid Silicon Photonic Integrated Circuit Technology,” IEEE J. Sel. Top. Quantum Electron. 19, 6100117 (2013).
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N. Volet, A. Spott, E. J. Stanton, M. L. Davenport, L. Chang, J. D. Peters, T. C. Briles, I. Vurgaftman, J. R. Meyer, and J. E. Bowers, “Semiconductor optical amplifiers at 2.0-μm wavelength on silicon,” Laser & Photonics Rev. 11, 1600165 (2017).
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D. Jevtics, A. Hurtado, B. Guilhabert, J. McPhillimy, G. Cantarella, Q. Gao, H. H. Tan, C. Jagadish, M. J. Strain, and M. D. Dawson, “Integration of semiconductor nanowire lasers with polymeric waveguide devices on a mechanically flexible substrate,” Nano Lett. 17, 5990–5994 (2017).
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D. Jevtics, A. Hurtado, B. Guilhabert, J. McPhillimy, G. Cantarella, Q. Gao, H. H. Tan, C. Jagadish, M. J. Strain, and M. D. Dawson, “Integration of semiconductor nanowire lasers with polymeric waveguide devices on a mechanically flexible substrate,” Nano Lett. 17, 5990–5994 (2017).
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G. Roelkens, A. Abassi, P. Cardile, U. Dave, A. de Groote, Y. de Koninck, S. Dhoore, X. Fu, A. Gassenq, N. Hattasan, Q. Huang, S. Kumari, S. Keyvaninia, B. Kuyken, L. Li, P. Mechet, M. Muneeb, D. Sanchez, H. Shao, T. Spuesens, A. Subramanian, S. Uvin, M. Tassaert, K. van Gasse, J. Verbist, R. Wang, Z. Wang, J. Zhang, J. van Campenhout, X. Yin, J. Bauwelinck, G. Morthier, R. Baets, and D. van Thourhout, “III–V-on-Silicon Photonic Devices for Optical Communication and Sensing,” Photonics. 2, 969–1004 (2015).
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Trindade, A. J.

Uvin, S.

N. Ye, G. Muliuk, A. J. Trindade, C. Bower, J. Zhang, S. Uvin, D. V. Thourhout, and G. Roelkens, “High-alignment-accuracy transfer printing of passive silicon waveguide structures,” Opt. Express 26, 2023 (2018).
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R. Wang, A. Vasiliev, M. Muneeb, A. Malik, S. Sprengel, G. Boehm, M.-C. Amann, I. Šimonytė, A. Vizbaras, K. Vizbaras, R. Baets, and G. Roelkens, “III–V-on-Silicon Photonic Integrated Circuits for Spectroscopic Sensing in the 2–4 μm Wavelength Range,” Sensors. 17, 1788 (2017).
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Zhang, J.

N. Ye, G. Muliuk, J. Zhang, A. Abbasi, A. J. Trindade, C. Bower, D. V. Thourhout, and G. Roelkens, “Transfer print integration of waveguide-coupled germanium photodiodes onto passive silicon photonic ICs,” J. Light. Technol. 36, 1249–1254 (2018).
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Opt. Express (5)

Photonics. (1)

G. Roelkens, A. Abassi, P. Cardile, U. Dave, A. de Groote, Y. de Koninck, S. Dhoore, X. Fu, A. Gassenq, N. Hattasan, Q. Huang, S. Kumari, S. Keyvaninia, B. Kuyken, L. Li, P. Mechet, M. Muneeb, D. Sanchez, H. Shao, T. Spuesens, A. Subramanian, S. Uvin, M. Tassaert, K. van Gasse, J. Verbist, R. Wang, Z. Wang, J. Zhang, J. van Campenhout, X. Yin, J. Bauwelinck, G. Morthier, R. Baets, and D. van Thourhout, “III–V-on-Silicon Photonic Devices for Optical Communication and Sensing,” Photonics. 2, 969–1004 (2015).
[Crossref]

Sensors. (1)

R. Wang, A. Vasiliev, M. Muneeb, A. Malik, S. Sprengel, G. Boehm, M.-C. Amann, I. Šimonytė, A. Vizbaras, K. Vizbaras, R. Baets, and G. Roelkens, “III–V-on-Silicon Photonic Integrated Circuits for Spectroscopic Sensing in the 2–4 μm Wavelength Range,” Sensors. 17, 1788 (2017).
[Crossref]

Soft Matter (1)

J. Wu, S. Kim, W. Chen, A. Carlson, K.-C. Hwang, Y. Huang, and J. A. Rogers, “Mechanics of reversible adhesion,” Soft Matter 7, 8657 (2011).
[Crossref]

Other (3)

C. Wang and T. Suga, “Moiré Method for Nanoprecision Wafer-to-Wafer Alignment : Theory, Simulation and Application,” Packag. Technol. pp. 219–224 (2009).

C. A. Bower, E. Menard, and P. E. Garrou, “Transfer printing: An approach for massively parallel assembly of microscale devices,” in “2008 58th Electronic Components and Technology Conference,” (IEEE, 2008).

T. Ahmed, A. A. Khan, G. Vigil, J. M. Kulick, G. H. Bernstein, A. J. Hoffman, and S. S. Howard, “Optical quilt packaging: A new chip-to-chip optical coupling and alignment process for modular sensors,” in “CLEO: 2014,” (OSA, 2014).

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Figures (7)

Fig. 1
Fig. 1 (a) Schematic illustration of membrane device fabrication and suspension; (b) SEM image of a single suspended membrane containing a Si ring resonator; (c) SEM image of suspended patterned membrane arrays on a singe SOI wafer.
Fig. 2
Fig. 2 (a) Schematic of transfer printing process of membrane devices from donor to receiver substrate, including magnified illustration of stacked device showing controlled lateral alignment of waveguide layers (Δx) controlling coupling between waveguides. The HSQ intermediate layer thickness is ≈100nm; (b) Illustration of the micro-assembly of devices between two substrates positioned on the system’s translation stage.
Fig. 3
Fig. 3 (a) Schematic illustration of sample containing two identical registration markers with a known separation of 2mm (not to scale); (b) Plot shows the marker correlation amplitude as a function of local translation around the marker in both x and y. The positional offset values noted include both measurement errors and lateral offsets caused by relative rotation of the sample to the stage axes.
Fig. 4
Fig. 4 (a) Diagram of probe tips physically producing controlled indent features into photo-resist layer relative to alignment marker; (b) 3-dimensional AFM topographic image of micro-tip indentations showing controlled separation distance; (c) Line profile of two relatively aligned indentations with a target controlled separation.
Fig. 5
Fig. 5 (a) SEM image of membrane waveguide ring resonator bonded to a SOI bus waveguide; (b) SEM top-view image of interlayer waveguides with a controlled lateral alignment optimising the waveguide coupling; (c) SEM image of membrane conforming over waveguide structure with a membrane thickness of 150nm; (d) Measured transmission spectrum of the Si ring resonator vertically coupled to a SOI bus waveguide.
Fig. 6
Fig. 6 (a) SEM image and (b) associated line sections of the coupler region of a micro-assembled ring resonator. The orange line profile corresponds to the dotted line in the image. The blue line profile is the averaged intensity taken from the bus waveguide sections at the left and right hand sides of the image; (c) SEM image and (d) line profiles of the bus waveguide as imaged through the membrane and in isolation.
Fig. 7
Fig. 7 SEM images showing the variation in positional waveguide alignments and targeted separation, including corresponding transmission spectra.

Tables (2)

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Table 1 Alignment error calculations

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Table 2 Comparison of micro-assembled SOI ring resonators with varying lateral offsets

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