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Dielectric properties of the silver–copper alloy films deposited by magnetron sputtering

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Abstract

The dielectric properties of Ag–Cu alloy films prepared by direct current magnetron sputtering were studied using variable angle spectroscopy ellipsometry. The dissipate loss of Ag–Cu alloy films was increased in the short wavelength (300–450 nm) with the increase of copper addition in silver alloys. The effective medium theory model was employed to characterize the surface roughness layer in the data simulation. Two typical peaks around 1.7 and 3.2 eV were presented for Ag–Cu alloys. The dielectric functions can be manipulated by the change of alloy composition and annealing temperature.

© 2013 Optical Society of America

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